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  93286-0114 Datasheet PDF File

For 93286-0114 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    75730-0104 75730-0106 75730-0108 75730-0110 75730-0112 75730-0114 75730-0116 75730-0118 75730-0120 75730-0122 75730-0124

Molex Electronics Ltd.
Part No. 75730-0104 75730-0106 75730-0108 75730-0110 75730-0112 75730-0114 75730-0116 75730-0118 75730-0120 75730-0122 75730-0124 75730-0150
Description Micro-Max Power垄芒 High-Current Header
Micro-Max Power High-Current Header

File Size 141.29K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0014600114

Molex Electronics Ltd.
Part No. 0014600114
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female,Single Row, Version G, Positive Lock, Wire Size 26, 3.81μm (150μ) Tin/Lead (SnPb),11 Circuits
Molex Electronics Ltd.

File Size 164.99K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    10150-6000EC 10150-6010EC 10126-6000EC 10114-6000EC 10114-6010EC

3M Electronics
Part No. 10150-6000EC 10150-6010EC 10126-6000EC 10114-6000EC 10114-6010EC
Description 3M Mini D Ribbon (MDR) Connectors

File Size 1,420.00K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114828-10114LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    0011-40-2222 0011402222

Molex Electronics Ltd.
Part No. 0011-40-2222 0011402222
Description Terminator Die

File Size 19.42K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114830-10114LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    ST Microelectronics
Part No. STLC90114 STLC90115
Description VDSL DMT CHIP SET

File Size 112.33K  /  8 Page

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Amphenol Communications Solutions

Part No. 10114508-D0J-20DLF
Description XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
Tech specs    

Official Product Page

    STLC90115 STLC90114

STMicroelectronics
Part No. STLC90115 STLC90114
Description ZIPPERWIRE VDSL DMT CHIP SET

File Size 111.97K  /  8 Page

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Amphenol Communications Solutions

Part No. 10114828-10102LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions
Tech specs    

Official Product Page

    1140-5291 11-40-5291 0011-40-5291 001140-5291 11405291 0011405291

Molex Electronics Ltd.
Part No. 1140-5291 11-40-5291 0011-40-5291 001140-5291 11405291 0011405291
Description Conductor Anvil

File Size 15.98K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114868-L0J-10DLF
Description XCede® High Speed Backplane Connectors, 3 wall left header.
Tech specs    

Official Product Page

    1140-5290 001140-5290 0011-40-5290 11405290 0011405290

Molex Electronics Ltd.
Part No. 1140-5290 001140-5290 0011-40-5290 11405290 0011405290
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114508-00J-20DLF
Description XCede® High Speed Backplane Connectors, 2 wall header.
Tech specs    

Official Product Page

    0011-40-2211 0011402211

Molex Electronics Ltd.
Part No. 0011-40-2211 0011402211
Description Terminator Die

File Size 19.42K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114492-008LF
Description HPCE R/A REC 32P24S
Tech specs    

Official Product Page

    0011404467

Molex Electronics Ltd.
Part No. 0011404467
Description Form and Conductor

File Size 11.64K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114868-10J-10DLF
Description XCede® High Speed Backplane Connectors, 4 wall header.
Tech specs    

Official Product Page

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