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  90130-1314 Datasheet PDF File

For 90130-1314 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    0901303330 90130-3330

Molex Electronics Ltd.
Part No. 0901303330 90130-3330
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 30 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating

File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4218-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90130-1206 0901301206

Molex Electronics Ltd.
Part No. 90130-1206 0901301206
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 6 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 6 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-4614-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0901303318 90130-3318

Molex Electronics Ltd.
Part No. 0901303318 90130-3318
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 18 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating

File Size 168.61K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4316-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    0901303316 90130-3316

Molex Electronics Ltd.
Part No. 0901303316 90130-3316
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 16 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating

File Size 168.61K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4618-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    0901301116 90130-1116

Molex Electronics Ltd.
Part No. 0901301116 90130-1116
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 16 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-4414-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Right End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0901303120

Molex Electronics Ltd.
Part No. 0901303120
Description
File Size 168.44K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4116-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    0510901300 51090-1300

Molex Electronics Ltd.
Part No. 0510901300 51090-1300
Description 2.00mm (.079) Pitch Mi II?/a> System Wire-to-Board Crimp Housing, Single Row, 13Circuits
2.00mm (.079) Pitch Mi II System Wire-to-Board Crimp Housing, Single Row, 13Circuits

File Size 87.21K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-4418-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Right End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    90130-1210 0901301210

Molex Electronics Ltd.
Part No. 90130-1210 0901301210
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 10 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 10 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-4414-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0901301106 90130-1106

Molex Electronics Ltd.
Part No. 0901301106 90130-1106
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded 6 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-4116-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    0901301108 90130-1108

Molex Electronics Ltd.
Part No. 0901301108 90130-1108
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 8 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.90K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-4418-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

For 90130-1314 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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