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  90130-1112 Datasheet PDF File

For 90130-1112 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    90130-1220 0901301220

Molex Electronics Ltd.
Part No. 90130-1220 0901301220
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 20 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 20 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 68690-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90130-1254 0901301254

Molex Electronics Ltd.
Part No. 90130-1254 0901301254
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 54 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 54 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 585.60K  /  7 Page

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Amphenol Communications Solutions

Part No. 92090-130LF
Description Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    90130-1268 0901301268

Molex Electronics Ltd.
Part No. 90130-1268 0901301268
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 68 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 68 Circuits, Black 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 578.23K  /  7 Page

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Amphenol Communications Solutions

Part No. 10065490-130TRLF
Description Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0901303120

Molex Electronics Ltd.
Part No. 0901303120
Description
File Size 168.44K  /  4 Page

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Amphenol Communications Solutions

Part No. 78290-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    0510901300 51090-1300

Molex Electronics Ltd.
Part No. 0510901300 51090-1300
Description 2.00mm (.079) Pitch Mi II?/a> System Wire-to-Board Crimp Housing, Single Row, 13Circuits
2.00mm (.079) Pitch Mi II System Wire-to-Board Crimp Housing, Single Row, 13Circuits

File Size 87.21K  /  2 Page

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Amphenol Communications Solutions

Part No. L17H2990130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    90130-1208 0901301208

Molex Electronics Ltd.
Part No. 90130-1208 0901301208
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded 8 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded 8 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 69190-130HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90130-1206 0901301206

Molex Electronics Ltd.
Part No. 90130-1206 0901301206
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 6 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 6 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 10136647-031112LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, Nylon 66, Tin plating, Natural Color, 3 Positions, GW Compatible, without Posts, Tray packing.
Tech specs    

Official Product Page

    0901303316 90130-3316

Molex Electronics Ltd.
Part No. 0901303316 90130-3316
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 16 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating

File Size 168.61K  /  4 Page

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Amphenol Communications Solutions

Part No. G832MC111202122HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 4.7 mm, 120 Positions, Dual Row, BTB Vertical Plug SMT, 15u\\ Gold Black.
Tech specs    

Official Product Page

    U77-A1112 U77-A1114 U77-A1113

Amphenol Corporation
Part No. U77-A1112 U77-A1114 U77-A1113
Description SFP SINGLE CASE WITH SOLDER PINS

File Size 802.53K  /  7 Page

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Amphenol Communications Solutions

Part No. 54242-111202300LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Surface Mount, Double Row, 20 Positions
Tech specs    

Official Product Page

    Ramtron International Corp.
Part No. FM1112-QGTR
Description
File Size 204.29K  /  8 Page

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Amphenol Communications Solutions

Part No. G832MC111204322HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 6.7 mm, 120 Positions, Dual Row, BTB Vertical Plug SMT, 8u\\ Gold Black.
Tech specs    

Official Product Page

For 90130-1112 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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