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Amphenol Communications Solutions |
| Part No. |
10142959-022LF
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| Description |
Minitek®2.5, Wire to Board Connectors, Crimp Terminal.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61083-081429LF
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| Description |
BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 80 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61082-041429LF
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| Description |
BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 40 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61083-141429LF
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| Description |
BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 140 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
89891-429HLF
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| Description |
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 58 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68771-429HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch, Vertical, 6.86 mm (0.27 in.) Mating, 2.54 mm (0.1 in.) Tail
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
76341-429LF
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| Description |
Dubox® 2.54mm, Board to Board Connector, PCB mounted Receptacle, Vertical, Through Hole, Top Entry, Single row , 29 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Cypress Semiconductor, Corp.
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| Part No. |
CY7C1423AV18-300BZI CY7C1423AV18-200BZI CY7C1429AV18-200BZXI CY7C1429AV18-278BZXI CY7C1429AV18-250BZXI CY7C1423AV18-200BZC CY7C1423AV18-278BZI CY7C1423AV18-250BZI CY7C1423AV18-300BZXC CY7C1423AV18-200BZXC CY7C1422AV18-278BZC CY7C1422AV18-167BZXI CY7C1424AV18-200BZXI
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| Description |
36-Mbit DDR-II SIO SRAM 2-Word Burst Architecture 2M X 18 DDR SRAM, 0.45 ns, PBGA165
36-Mbit DDR-II SIO SRAM 2-Word Burst Architecture 4M X 9 DDR SRAM, 0.45 ns, PBGA165
36-Mbit DDR-II SIO SRAM 2-Word Burst Architecture 4M X 8 DDR SRAM, 0.45 ns, PBGA165
36-Mbit DDR-II SIO SRAM 2-Word Burst Architecture 4M X 8 DDR SRAM, 0.5 ns, PBGA165
36-Mbit DDR-II SIO SRAM 2-Word Burst Architecture 1M X 36 DDR SRAM, 0.45 ns, PBGA165
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| File Size |
434.33K /
31 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68001-429HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 29 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Cypress Semiconductor, Corp.
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| Part No. |
CY7C1423BV18-200BZI CY7C1423BV18-300BZI CY7C1429BV18-278BZI CY7C1429BV18-250BZI CY7C1429BV18-278BZC CY7C1429BV18-250BZC CY7C1429BV18-300BZI CY7C1422BV18-200BZXI CY7C1422BV18-167BZXC CY7C1422BV18-200BZXC CY7C1423BV18-200BZC CY7C1423BV18-278BZI CY7C1423BV18-250BZI CY7C1424BV18-278BZI CY7C1424BV18-278BZXC CY7C1423BV18-200BZXC CY7C1422BV18-250BZXI CY7C1424BV18-250BZXC
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| Description |
36-Mbit DDR-II SIO SRAM 2-Word Burst Architecture 2M X 18 DDR SRAM, 0.45 ns, PBGA165
36-Mbit DDR-II SIO SRAM 2-Word Burst Architecture 4M X 9 DDR SRAM, 0.45 ns, PBGA165
36-Mbit DDR-II SIO SRAM 2-Word Burst Architecture 4M X 8 DDR SRAM, 0.45 ns, PBGA165
36-Mbit DDR-II SIO SRAM 2-Word Burst Architecture 4M X 8 DDR SRAM, 0.5 ns, PBGA165
36-Mbit DDR-II SIO SRAM 2-Word Burst Architecture 1M X 36 DDR SRAM, 0.45 ns, PBGA165
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| File Size |
433.13K /
30 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
61082-141429LF
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| Description |
BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 140 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
71991-429LF
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| Description |
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry, 58 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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