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  75757-1461 Datasheet PDF File

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    0757571181 75757-1181

Molex Electronics Ltd.
Part No. 0757571181 75757-1181
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 16 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length
3.50mm (.138) Pitch, MX150垄芒 Header, Breakaway, Vertical, 16 Circuits, 2.5楼矛m (100楼矛) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length

File Size 166.63K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4614-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0757570132 75757-0132

Molex Electronics Ltd.
Part No. 0757570132 75757-0132
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits

File Size 99.29K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-4618-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    0757571101 75757-1101

Molex Electronics Ltd.
Part No. 0757571101 75757-1101
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 20 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length
3.50mm (.138) Pitch, MX150垄芒 Header, Breakaway, Vertical, 20 Circuits, 2.5楼矛m (100楼矛) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length

File Size 166.58K  /  4 Page

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Amphenol Communications Solutions

Part No. RJE491881461
Description Modular Jack - High Performance, Input Output Connectors 8P8C, CAT6, Shield, With LEDs.
Tech specs    

Official Product Page

    0757576481

Molex Electronics Ltd.
Part No. 0757576481
Description
File Size 166.20K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4614-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Right Polarized, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    0757571201 75757-1201

Molex Electronics Ltd.
Part No. 0757571201 75757-1201
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, Gold (Au) Flash Plating
3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, Gold (Au) Flash Plating

File Size 166.56K  /  4 Page

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Amphenol Communications Solutions

Part No. 77311-146-11LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 11 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0757576101 75757-6101

Molex Electronics Ltd.
http://
Part No. 0757576101 75757-6101
Description 3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 2.5um (100u") Tin (Sn) Plating
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 2.5um (100u) Tin (Sn) Plating

File Size 166.22K  /  4 Page

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Amphenol Communications Solutions

Part No. RJE4E1881461
Description Modular Jacks, Input Output Connectors, 8P8C, With Shield, With LEDs.
Tech specs    

Official Product Page

    75757-0352 0757570352

Molex Electronics Ltd.
Part No. 75757-0352 0757570352
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 99.22K  /  3 Page

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Amphenol Communications Solutions

Part No. RJE721881461T
Description Modular Jacks, Input Output Connectors, 8P8C, Right angle, CAT5e, Shield, Recessed Profile, With LEDs
Tech specs    

Official Product Page

    0757570152 75757-0152

Molex Electronics Ltd.
Part No. 0757570152 75757-0152
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 5 Circuits, 1.25um (50u) Nickel (Ni) Overall
MOLEX Connector

File Size 99.39K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-4616-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    0757570161 75757-0161

Molex Electronics Ltd.
Part No. 0757570161 75757-0161
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating Overall
MOLEX Connector

File Size 99.39K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-146-16LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    75757-6241 0757576241

Molex Electronics Ltd.
Part No. 75757-6241 0757576241
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 8 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 166.28K  /  4 Page

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Amphenol Communications Solutions

Part No. RJE481881461
Description Modular Jack - High Performance, Input Output Connectors 8P8C, CAT5e, Shield, With LEDs.
Tech specs    

Official Product Page

For 75757-1461 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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