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  75757-1421 Datasheet PDF File

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    0757571261

Molex Electronics Ltd.
Part No. 0757571261
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, Gold (Au) Flash Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
File Size 166.45K  /  4 Page

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Amphenol Communications Solutions
Part No. 131-4214-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Double End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    75757-0351 0757570351

Molex Electronics Ltd.
Part No. 75757-0351 0757570351
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 5 Circuits
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 5 Circuits
File Size 99.22K  /  3 Page

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Amphenol Communications Solutions
Part No. 131-4214-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Double End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs 　 　

Official Product Page

    0757571342 75757-1342

Molex Electronics Ltd.
Part No. 0757571342 75757-1342
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 8 Circuits, 0.75μm (30μ) Select Gold (Au) Plating, 11.20mm (.441) Mating Pin Length
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 8 Circuits, 0.75μm (30μ) Select Gold (Au) Plating, 11.20mm (.441) Mating Pin Length
MOLEX Connector
File Size 166.66K  /  4 Page

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Amphenol Communications Solutions
Part No. 78511-421HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    75757-0262 0757570262

Molex Electronics Ltd.
Part No. 75757-0262 0757570262
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
File Size 99.22K  /  3 Page

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Amphenol Communications Solutions
Part No. 68771-421HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch, Vertical, 6.86 mm (0.27 in.) Mating, 2.54 mm (0.1 in.) Tail
Tech specs 　 　

Official Product Page

    0757571101 75757-1101

Molex Electronics Ltd.
Part No. 0757571101 75757-1101
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 20 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length
3.50mm (.138) Pitch, MX150垄芒 Header, Breakaway, Vertical, 20 Circuits, 2.5楼矛m (100楼矛) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length
File Size 166.58K  /  4 Page

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Amphenol Communications Solutions
Part No. 76314-213
Description Dubox® 2.54mm, Board to Board Connector, 26 Positions,Double Row,Vertical,2.54mm pitch,Card Connector.
Tech specs 　 　

Official Product Page

    0757571121 75757-1121

Molex Electronics Ltd.
Part No. 0757571121 75757-1121
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
3.50mm (.138") Pitch, MX150垄芒 Header, Breakaway, Vertical, 4 Circuits, 2.5楼矛m (100楼矛") Tin (Sn) Plating, 11.20mm (.441") Mating Pin Length, 3.05mm (.120") PC Ta
File Size 166.62K  /  4 Page

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Amphenol Communications Solutions
Part No. 130-3142-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, APP.
Tech specs 　 　

Official Product Page

    0757571141 75757-1141

Molex Electronics Ltd.
Part No. 0757571141 75757-1141
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 8 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 8 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
3.50mm (.138) Pitch, MX150垄芒 Header, Breakaway, Vertical, 8 Circuits, 2.5楼矛m (100楼矛) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail L
File Size 166.64K  /  4 Page

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Amphenol Communications Solutions
Part No. 131-4218-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    0757571161 75757-1161

Molex Electronics Ltd.
Part No. 0757571161 75757-1161
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length
3.50mm (.138) Pitch, MX150垄芒 Header, Breakaway, Vertical, 12 Circuits, 2.5楼矛m (100楼矛) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length
File Size 166.64K  /  4 Page

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Amphenol Communications Solutions
Part No. 131-4414-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Right End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    0757571181 75757-1181

Molex Electronics Ltd.
Part No. 0757571181 75757-1181
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 16 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length
3.50mm (.138) Pitch, MX150垄芒 Header, Breakaway, Vertical, 16 Circuits, 2.5楼矛m (100楼矛) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length
File Size 166.63K  /  4 Page

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Amphenol Communications Solutions
Part No. 131-6214-21D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Double End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    75757-0261 0757570261

Molex Electronics Ltd.
Part No. 75757-0261 0757570261
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
File Size 99.22K  /  3 Page

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Amphenol Communications Solutions
Part No. 131-7614-21D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 4 Column, Right Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

For 75757-1421 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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