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  71439-3164 Datasheet PDF File

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    HYB3164165BTL-60 HYB3164165BTL-50 HYB3164165BTL-40 HYB3164165BT-60 HYB3164165BT-50 HYB3164165BT-40 HYB3165165BTL-60 HYB3

Infineon
SIEMENS[Siemens Semiconductor Group]
Part No. HYB3164165BTL-60 HYB3164165BTL-50 HYB3164165BTL-40 HYB3164165BT-60 HYB3164165BT-50 HYB3164165BT-40 HYB3165165BTL-60 HYB3165165BTL-50 HYB3165165BTL-40 HYB3165165BT-60 HYB3165165BT-50 HYB3165165BT-40 HYB3166165BTL-60 HYB3164165BT HYB3166165BT-40 HYB3166165BT-50 HYB3166165BT-60 HYB3166165BTL-50
Description 4M x 16 Bit 4k EDO DRAM Low Power
4M x 16-Bit Dynamic RAM (8k, 4k & 2k Refresh, EDO-version)
File Size 302.81K  /  29 Page

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Amphenol Communications Solutions
Part No. 61083-164402LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    SIEMENS AG
Part No. HYB31645800ATL HYB3165800AJ-40 HYB3164800AJ-40 HYB3164800AT-60
Description High-Speed Fully-Differential Amplifiers 8-SOIC -40 to 85
8M x 8-Bit Dynamic RAM
High-Speed Fully-Differential Amplifiers 8-MSOP-PowerPAD -40 to 85 8M X 8 FAST PAGE DRAM, 60 ns, PDSO32
File Size 252.98K  /  26 Page

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Amphenol Communications Solutions
Part No. 131-6414-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    HYB3165160ATL-60 HYB3165160AT-60 HYB3164160AT-40 HYB3166160AT-40 HYB3165160AT-40 HYB3164160ATL-60 HYB3164160AT-50 HYB316

Siemens Semiconductor G...
SIEMENS AG
Siemens Semiconductor Group
Part No. HYB3165160ATL-60 HYB3165160AT-60 HYB3164160AT-40 HYB3166160AT-40 HYB3165160AT-40 HYB3164160ATL-60 HYB3164160AT-50 HYB3166160ATL-50 HYB3165160AT-50 HYB3166160AT-50
Description    4M x 16-Bit Dynamic RAM
High-Speed Fully-Differential Amplifiers 8-SOIC 0 to 70
4M x 16-Bit Dynamic RAM 4M X 16 FAST PAGE DRAM, 50 ns, PDSO50
File Size 221.37K  /  26 Page

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Amphenol Communications Solutions
Part No. 131-6418-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs 　 　

Official Product Page

   
Part No. IBM0316409CT3-13 IBM0316169CT3-11 IBM0316169CT3-13 IBM0316809CT3-11
Description x4 SDRAM
x16 SDRAM
x8 SDRAM
File Size 13,096.44K  /  99 Page

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Amphenol Communications Solutions
Part No. 69133-164HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 64 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

   
Part No. IBM0316809CT3-10H IBM0316809CT3-12H IBM0316169CT3-10H IBM0316409CT3-10H IBM0316409CT3-12H
Description x8 SDRAM
x16 SDRAM
x4 SDRAM
File Size 6,410.23K  /  104 Page

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Amphenol Communications Solutions
Part No. 77316-448LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single row , Polarized, 3 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    HYB3164165ATL-60 HYB3164165ATL-50 HYB3164165ATL-40 HYB3164165AT-60 HYB3164165AT-50 HYB3165165ATL-60 HYB3165165ATL-50 HYB

Infineon
SIEMENS[Siemens Semiconductor Group]
Part No. HYB3164165ATL-60 HYB3164165ATL-50 HYB3164165ATL-40 HYB3164165AT-60 HYB3164165AT-50 HYB3165165ATL-60 HYB3165165ATL-50 HYB3165165ATL-40 HYB3165165AT-60 HYB3165165AT-50 HYB3165165AT-40 HYB3164165AT-40 HB64165A HYB3166165ATL-60 HYB3164165AT HYB3166165AT-40 HYB3166165AT-50 HYB3166165AT-60 HYB3166165ATL-50
Description 4M x 16 Bit 4k EDO DRAM Low Power
4M x 16 Bit 8k EDO DRAM
4M x 16-Bit Dynamic RAM (8k, 4k & 2k Refresh, EDO-Version)
From old datasheet system
File Size 284.54K  /  29 Page

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Amphenol Communications Solutions
Part No. 131-6414-21H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Right End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs 　 　

Official Product Page

    HYB3164160ATL-60 HYB3164160ATL-50 HYB3164160ATL-40 HYB3164160AT-60 HYB3164160AT-50 HYB3164160AT-40 HYB3165160AT-40 HYB31

Infineon
SIEMENS[Siemens Semiconductor Group]
Part No. HYB3164160ATL-60 HYB3164160ATL-50 HYB3164160ATL-40 HYB3164160AT-60 HYB3164160AT-50 HYB3164160AT-40 HYB3165160AT-40 HYB3165160ATL-50 HYB3165160ATL-60 HB64160A HYB3166160ATL-60 HYB3164160AT HYB3165160AT-50 HYB3165160AT-60 HYB3166160AT-40 HYB3166160AT-50 HYB3166160AT-60 HYB3166160ATL-50
Description 4M x 16 Bit 4k DRAM
4M x 16-Bit Dynamic RAM ( 8k, 4k & 2k Refresh)
From old datasheet system
File Size 215.61K  /  26 Page

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Amphenol Communications Solutions
Part No. 61083-164500PLF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs 　 　

Official Product Page

    HYB31645400ATL HYB3165400AJ-40 HYB3164400AJ-40 HYB3164400AT-50 HYB3164400AT-40 HYB3165400ATL-40 HYB3165400AT-40 HYB31644

Siemens Semiconductor Group
SIEMENS AG
Infineon Technologies AG
Part No. HYB31645400ATL HYB3165400AJ-40 HYB3164400AJ-40 HYB3164400AT-50 HYB3164400AT-40 HYB3165400ATL-40 HYB3165400AT-40 HYB3164400ATL-40 HYB3165400AJ-60
Description 16M x 4-Bit Dynamic RAM
High-Speed Fully-Differential Amplifiers 8-MSOP-PowerPAD -40 to 85
High-Speed Fully-Differential Amplifiers 8-MSOP-PowerPAD 0 to 70
16M X 4 FAST PAGE DRAM, 40 ns, PDSO32 0.400 INCH, PLASTIC, SOJ-32
16M X 4 FAST PAGE DRAM, 40 ns, PDSO32 0.400 INCH, PLASTIC, TSOP2-32
Bipolar Transistor; Collector Emitter Voltage, Vceo:75V; Power Dissipation, Pd:1.67W; DC Current Gain Min (hfe):120; C-E Breakdown Voltage:75V; Collector Current:1A; Transistor Polarity:NPN RoHS Compliant: Yes 16M X 4 FAST PAGE DRAM, 60 ns, PDSO32
File Size 252.48K  /  26 Page

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Amphenol Communications Solutions
Part No. 77316-444LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single row , Polarized, 7 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    Advanced Interconnections, Corp.
Part No. CA3164AE ICL8049CJE ICL8069MZR ICL8069MSQ ICL8013MTX ICL8063MPE ICL8063CJE
Description Industrial Control IC
Analog IC
Logic IC 逻辑IC
Interface IC 接口IC
File Size 100.01K  /  1 Page

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Amphenol Communications Solutions
Part No. 61083-164409LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs 　 　

Official Product Page

    TE Connectivity, Ltd.
PHOENIX CONTACT Deutschland GmbH
Part No. 1045220410 1045220810 1045316010 1045316810 1045316410 1045116810 1045118010
Description KONDENSATOR POLYE RADIA 2.2UF 50V RM5.0
KONDENSATOR POLYE RADIA 3.3UF 50V RM5.0
KONDENSATOR POLYE RADI 0.033UF 100V RM5
KONDENSATOR POLYE RADI 0.068UF 100V RM5
KONDENSATOR POLYE RADI 0.068UF 63V RM5.0
KONDENSATOR POLYE RADI 0.047UF 100V RM5 KONDENSATOR POLYE拉迪0.047UF 100V的令
KONDENSATOR POLYE RADI 0.22UF 63V RM5.0 KONDENSATOR POLYE拉迪0.22UF 63V RM5.0
File Size 129.17K  /  2 Page

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Amphenol Communications Solutions
Part No. 131-6416-21H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Right End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs 　 　

Official Product Page

For 71439-3164 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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