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  609-1482 Datasheet PDF File

For 609-1482 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    43650-0609

Molex Electronics Ltd.
Part No. 43650-0609
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Header, Surface Mount Compatible, Single Row,Right Angle, with PCB Press-fit Metal Retention Clip, 6 Circuits, Tin (Sn) Plating, Glow Wire Compatible

File Size 163.30K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114828-10102LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Framatome Connectors International
Part No. 8609-348-XXXX 8609-396-71-XXXX 8609-396-XXXX 8609-432-XXXX 8609-464-XXXX
Description (8609-Series) Standard Male / 3 Row

File Size 298.25K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114820-1013LF
Description Metral®, Backplane connectors, 1000 Series Header, Vertical Signal, 8 Row, Press-Fit, 96 Position, Select Load, Extended
Tech specs    

Official Product Page

    AHTA-1609S

Allied Components International
Part No. AHTA-1609S
Description 10/100 Base T Single Port Transformer

File Size 233.00K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114828-11206LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 6 Positions
Tech specs    

Official Product Page

   
Part No. 8609-232-58-14-H68-000-E1 8609-232-58-14-R48-000-E1 8609-232-58-24-H58-000-E1 8609-232-58-24-758-000-E1
Description 32 CONTACT(S), MALE, STRAIGHT TWO PART EURO CONNECTOR, SOLDER

File Size 89.48K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114829-11103LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 3 Positions
Tech specs    

Official Product Page

    JAN2N1480 JAN2N1479 2N1482

Microsemi Corporation
Part No. JAN2N1480 JAN2N1479 2N1482
Description NPN SILICON MEDIUM POWER TRANSISTOR
   NPN SILICON MEDIUM POWER TRANSISTOR

File Size 50.97K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114829-11108LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 8 Positions
Tech specs    

Official Product Page

    MAX14820ETG

Maxim Integrated Products
Part No. MAX14820ETG
Description IO-Link Device Transceiver

File Size 1,826.94K  /  29 Page

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Amphenol Communications Solutions

Part No. 10114829-10102LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 2 Positions
Tech specs    

Official Product Page

    MAXIM - Dallas Semiconductor
Part No. MAX14820ETG
Description IO-Link Device Transceiver

File Size 317.99K  /  30 Page

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Amphenol Communications Solutions

Part No. 10114829-10108LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 8 Positions
Tech specs    

Official Product Page

    SHD14823409

Sensitron
Part No. SHD14823409
Description HERMETIC POWER SCHOTTKY RECTIFIER Ultra Low Reverse Leakage 200掳C Operating Temperature

File Size 52.40K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114829-10106LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 6 Positions
Tech specs    

Official Product Page

    MAX14824 MAX14824GTG

Maxim Integrated Products
Maxim Integrated Produc...
Part No. MAX14824 MAX14824GTG
Description IO-Link Master Transceiver

File Size 1,436.12K  /  28 Page

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Amphenol Communications Solutions

Part No. 10114828-11115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs    

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    RN4609

Toshiba Semiconductor
Part No. RN4609
Description Silicon PNP Epitaxial Type (PCT Process) Silicon NPN Epitaxial Type (PCT Process)

File Size 402.34K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114829-10103LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 3 Positions
Tech specs    

Official Product Page

For 609-1482 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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