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  45984-1162 Datasheet PDF File

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    45984-1121

Molex Electronics Ltd.
Part No. 45984-1121
Description 1.27mm (.050), 12.00mm (.472) Pitch, EXTreme LPHPower Receptacle HeaderRight Angle, 10 Power Contacts, 16 Signal Contacts, Select Gold (Au) Plating, for
File Size 451.76K  /  7 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. 2SA1162
Description PNP Bipolar Transistor / VCEO=-50 V / IC=-0.15 A / hFE=70~400 / VCE(sat)=-0.3 V / AEC-Q101 / SOT-346
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HUA FENG CIRCUIT





    45984-1112

Molex Electronics Ltd.
Part No. 45984-1112
Description 1.27mm (.050), 12.00mm (.472) Pitch, EXTreme LPHPower Receptacle Header, Right Angle, 10 Power Contacts
File Size 451.76K  /  7 Page

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Amphenol Communications Solutions
Part No. 79821-162HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
Tech specs 　 　

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    45984-6372

Molex Electronics Ltd.
Part No. 45984-6372
Description 1.27mm (.050), 12.00mm (.472) Pitch, EXTreme LPHPower Receptacle Header, Right Angle, 6 Power
File Size 431.62K  /  7 Page

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Amphenol Communications Solutions
Part No. 131-5116-21D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs 　 　

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    45984-6373

Molex Electronics Ltd.
Part No. 45984-6373
Description 1.27mm (.050), 12.00mm (.472) Pitch, EXTreme LPHPower Receptacle Header, Right Angle, 6 Power Contacts
File Size 431.61K  /  7 Page

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Amphenol Communications Solutions
Part No. 131-4116-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs 　 　

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    45984-4411

Molex Electronics Ltd.
Part No. 45984-4411
Description 1.27mm (.050), 12.00mm (.472) Pitch, EXTreme LPHPower Receptacle Header
File Size 417.47K  /  7 Page

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Amphenol Communications Solutions
Part No. 77311-162-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs 　 　

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    45984-4442

Molex Electronics Ltd.
Part No. 45984-4442
Description 1.27mm (.050), 12.00mm (.472) Pitch, EXTreme LPHPower Receptacle Header, Right Angle, 4 Power Contacts
File Size 417.47K  /  7 Page

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Amphenol Communications Solutions
Part No. 10127721-162GLF
Description Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 16 Position, 3.2mm Kink Tail (Gold Flash) plating, GW Compatible LCP, Black Color,Tray Packing.
Tech specs 　 　

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    45984-4443

Molex Electronics Ltd.
Part No. 45984-4443
Description 1.27mm (.050), 12.00mm (.472) Pitch, EXTreme LPHPower Receptacle Header, Right Angle, 4 Power Contacts
File Size 417.46K  /  7 Page

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Amphenol Communications Solutions
Part No. 75168-116-20LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    45984-4932

Molex Electronics Ltd.
Part No. 45984-4932
Description EXTreme LPHPower Receptacle Header, Right Angle, 4 Power Contacts, Select Gold (Au) Plating
File Size 348.63K  /  7 Page

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Amphenol Communications Solutions
Part No. 54242-811162350LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    45984-1221

Molex Electronics Ltd.
Part No. 45984-1221
Description 1.27mm (.050), 12.00mm (.472) Pitch, EXTreme LPHPower Receptacle Header,Right Angle, 10 Power Contacts, 16 Signal Contacts, Select Gold (Au) Plating, for 3.18mm (.125) Thick PC Board
File Size 451.77K  /  7 Page

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Amphenol Communications Solutions
Part No. 131-3116-21D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    45984-4441

Molex Electronics Ltd.
Part No. 45984-4441
Description 1.27mm (.050), 12.00mm (.472) Pitch, EXTreme LPHPower Receptacle Header,Right Angle, 4 Power Contacts, 24 Signal Contacts, Select Gold (Au) Plating, for 3.18mm (.125) Thick PC Board
File Size 417.47K  /  7 Page

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Amphenol Communications Solutions
Part No. 131-8116-21D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

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