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  31101-004 Datasheet PDF File

For 31101-004 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    ITW Switches
Part No. 18-000-0042
Description SPANNUNGSWAEHLER 2POL SPANNUNGSWAEHLER 2POL
File Size 235.00K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs 　 　

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HUA FENG CIRCUIT





    TELEDYNE[Teledyne Technologies Incorporated]
Part No. TMA-18-2004
Description Amplifier 2 GHz - 18 GHz
File Size 885.37K  /  2 Page

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Amphenol Communications Solutions
Part No. 85763-1101
Description Metral® Board Connectors, Backplane Connectors, 5 Row Signal Receptacle, Straight, Press-Fit.
Tech specs 　 　

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    TELEDYNE[Teledyne Technologies Incorporated]
Part No. CPT-13-6004
Description Temperature Compensated Amplifier 6 GHz - 13 GHz
File Size 883.56K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114831-10112LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 12 POSITIONS, TIN PLATING
Tech specs 　 　

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Part No. 0412-004-3
Description PANEL MOUNT, TNC CONNECTOR, JACK
File Size 71.81K  /  1 Page

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Amphenol Communications Solutions
Part No. 90311-014LF
Description Minitek®, Wire to Board Connector, 2.00mm (0, 079in), Crimp to Wire Housing, Polarized with Latch, Double Row, 14 positions
Tech specs 　 　

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    OD-850-004 OD-850F-18

OptoDiode Corp
Part No. OD-850-004 OD-850F-18
Description High-Power GaAlAs IR Emitters
File Size 163.83K  /  4 Page

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Amphenol Communications Solutions
Part No. 10114831-10103LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 3 POSITIONS, TIN PLATING
Tech specs 　 　

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    TELEDYNE[Teledyne Technologies Incorporated]
Part No. CPA-8-2004
Description Amplifier 2 GHz - 8 GHz
File Size 884.02K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114831-10102LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 2 POSITIONS, TIN PLATING
Tech specs 　 　

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    TELEDYNE[Teledyne Technologies Incorporated]
Part No. TGM-20-2004
Description Module Amplifier 2 GHz - 20 GHz
File Size 903.16K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114831-10111LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 11 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    Teledyne Technologies Incorporated.
TELEDYNE[Teledyne Technologies Incorporated]
Part No. TLA-18-6004
Description Low Noise Amplifier 6 GHz - 18 GHz
File Size 889.51K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114831-10105LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 5 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    TELEDYNE[Teledyne Technologies Incorporated]
Part No. CPT-18-6004
Description Temperature Compensated Amplifier 6 GHz - 18 GHz
File Size 883.58K  /  2 Page

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Amphenol Communications Solutions
Part No. 68031-101HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
Tech specs 　 　

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    TELEDYNE[Teledyne Technologies Incorporated]
Part No. CPT-18-8004
Description Temperature Compensated Amplifier 8 GHz - 18 GHz
File Size 883.60K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114831-10113LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

For 31101-004 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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