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  2040.0713 Datasheet PDF File

For 2040.0713 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    71349-2003 0713492003

Molex Electronics Ltd.
Part No. 71349-2003 0713492003
Description 2.54mm (.100

File Size 420.24K  /  5 Page

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Amphenol Communications Solutions

Part No. 89007-136LF
Description Metral® Board Connectors, Backplane Connectors, 5 Row Signal Header, Straight, Press-Fit, Wide body.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    71349-2005 0713492005

Molex Electronics Ltd.
Part No. 71349-2005 0713492005
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded,14 Circuits, Tin (Sn) Plating, with Press-fit Plastic Pegs

File Size 420.24K  /  5 Page

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Amphenol Communications Solutions

Part No. 77315-107-13LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    71349-2001 0713492001

Molex Electronics Ltd.
Part No. 71349-2001 0713492001
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, Shrouded, 6 Circuits, Tin (Sn) Plating, with Press-fit Plastic Pegs

File Size 420.25K  /  5 Page

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Amphenol Communications Solutions

Part No. U95Z1054071321
Description QSFP STACKED COMBO NO LP
Tech specs    

Official Product Page

    71349-2002 0713492002

Molex Electronics Ltd.
Part No. 71349-2002 0713492002
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded, 8Circuits, Tin (Sn) Plating, with Press-fit Plastic Pegs

File Size 420.24K  /  5 Page

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Amphenol Communications Solutions

Part No. 78207-130
Description PV®Wire-to-Board Connector System, 2 Wall Shrouded Right angled Header - Through Hole - Double row - 30 Positions, 2.54mm (0.100in) pitch.
Tech specs    

Official Product Page

    0713086472

Molex Electronics Ltd.
Part No. 0713086472
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 72 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 72 Circuits,1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30

File Size 1,475.71K  /  8 Page

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Amphenol Communications Solutions

Part No. U95Z2054071341
Description QSFP 2X2 COMBO SP FG NO LP
Tech specs    

Official Product Page

    0713086450 71308-6450

Molex Electronics Ltd.
Part No. 0713086450 71308-6450
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 50 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 77315-407-13LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0713086428 71308-6428

Molex Electronics Ltd.
Part No. 0713086428 71308-6428
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 28 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)

File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions

Part No. 98426-S04-07-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 14 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0713086412 71308-6412

Molex Electronics Ltd.
Part No. 0713086412 71308-6412
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 12 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. U95Z2054071301
Description QSFP 2X2 COMBO SP FG NO LP
Tech specs    

Official Product Page

    0713086416 71308-6416

Molex Electronics Ltd.
Part No. 0713086416 71308-6416
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 16 Circuits, 1.50um (59u) Minimum

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 98426-G04-07-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 14 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0713086420 71308-6420

Molex Electronics Ltd.
Part No. 0713086420 71308-6420
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 20 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 66207-136LF
Description Quickie® IDC Cable-to-Board Connector System, Eject Latch Header, Vertical, Through Hole, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 2040.0713 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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