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  typo Datasheet PDF File

For typo Found Datasheets File :: 753    Search Time::1.265ms    
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    Samsung Semiconductor Co., Ltd.
Part No. K4H560438E-ZLB30 K4H560838E-ZLB30
OCR Text ...e 1.1 august 2003 - corrected typo 1.2 october 2004 - corrected typo 1.3 july 2005 - changed master format rev. 1.3 july. 2005 ddr sdram ddr sdram 256mb e-die (x4, x8) ? vdd : 2.5v 0.2v, vddq : 2.5v 0.2v for ddr333 ? vdd : 2.6v ...
Description 64M X 4 DDR DRAM, 0.7 ns, PBGA60 ROHS COMPLIANT, FBGA-60
32M X 8 DDR DRAM, 0.7 ns, PBGA60 ROHS COMPLIANT, FBGA-60

File Size 385.02K  /  24 Page

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    Sensitron Semiconductor
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4D263238G-GC360 K4D263238G-GC33 K4D263238G-GC2A0 K4D263238G-VC K4D263238G-VC330
OCR Text ...8g-vc2a and k4d263238g-vc33. ? typo corrected revision 1.5 (december 29, 2004) ? added tck(min)=5ns @ cl3 ? changed tck(max) of k4d263238g-gc2a from 4ns to 10ns revision 1.4 (november 30, 2004) ? typo corrected in dc table revision ...
Description 4M X 32 DDR DRAM, 0.6 ns, PBGA144 FBGA-144
128Mbit GDDR SDRAM 128Mbit GDDR SDRAM内存
4M X 32 DDR DRAM, 0.55 ns, PBGA144 FBGA-144
4M X 32 DDR DRAM, 0.55 ns, PBGA144 LEAD FREE, FBGA-144

File Size 431.90K  /  20 Page

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    Hynix Semiconductor, Inc.
Part No. HY5RS123235FP-2 HY5RS123235FP-16 HY5RS123235FP-11 HY5RS123235FP-12
OCR Text ... al definitions page47) table18 typo corrected page48) table19 renewered page50) note 46 added july.2004 cl wl di/wr_a/al speed bin several parameters trpre 0.3 page4) ballout configurations correct appendix c) bst function description aug....
Description 16M X 32 DDR DRAM, 0.25 ns, PBGA136 12 X 14 MM, LEAD FREE, FBGA-136

File Size 913.59K  /  62 Page

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    Hynix Semiconductor, Inc.
HYNIX SEMICONDUCTOR INC
Part No. H5PS5162GFR-S5L H5PS5162GFR-S5I H5PS5162GFR-S5J H5PS5162GFR-S5C H5PS5162GFR-Y5J
OCR Text ...products nov.2010 1.3 corrected typo dec.2010 1.4 corrected typo feb.2011 1.5 merged with x8 series(h5ps5182gfr) mar.2011 rev.1.5 / mar. 2011 ...
Description 32M X 16 DDR DRAM, 0.4 ns, PBGA84 7.50 X 12.50 MM, ROHS COMPLIANT, FBGA-84
32M X 16 DDR DRAM, 0.45 ns, PBGA84

File Size 846.71K  /  64 Page

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    Hynix Semiconductor, Inc.
Part No. HY5RS123235BFP-14 HY5RS123235BFP-18L HY5RS123235BFP-08 HY5RS123235BFP-2 HY5RS123235BFP-11
OCR Text ...ghz speed on page 54 2. changed typo for ron on page 15 3. added note.48 on page 53 aug. 2006 preliminary 0.6 1. changed trrd from 16 to 13 and twtr from 8 to 10 at tck=0.8 2. inserted ac parameter value on 800mhz(tck=1.2) for referenc...
Description 16M X 32 DDR DRAM, 0.26 ns, PBGA136 11 X 14 MM, ROHS COMPLIANT, FBGA-136
16M X 32 DDR DRAM, PBGA136 11 X 14 MM, ROHS COMPLIANT, FBGA-136
16M X 32 DDR DRAM, 0.35 ns, PBGA136 11 X 14 MM, ROHS COMPLIANT, FBGA-136
16M X 32 DDR DRAM, 0.22 ns, PBGA136 11 X 14 MM, ROHS COMPLIANT, FBGA-136

File Size 1,104.02K  /  67 Page

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    Samsung Semiconductor Co., Ltd.
Part No. M470T3354EZ3-LD5
OCR Text ... 1.2 january 2007 - corrected typo 1.3 april 2007 - added the bookmark 1.4 april 2007 - corrected typo rev. 1.4 april 2007 ddr2 sdram sodimm 4 of 20 note : 1. ?z? of part number(11th digit) stand for lead-free products. 2. ?3? of p...
Description 32M X 64 DDR DRAM MODULE, 0.5 ns, ZMA200 ROHS COMPLIANT, SODIMM-200

File Size 343.91K  /  20 Page

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    Samsung Semiconductor Co., Ltd.
Part No. M470T2953CZ0-LD5 M470T2953CZ3-LD5
OCR Text ...g of physical dimension and the typo 1.7 april 2007 - corrected typo. rev. 1.6 march 2007 sodimm ddr2 sdram page 4 of 20 note : 1. ?z? of part number(11th digit) stand for lead-free products. 2. ?3? of part number(12th digit) stand for du...
Description 128M X 64 DDR DRAM MODULE, 0.5 ns, ZMA200 ROHS COMPLIANT, SODIMM-200

File Size 345.22K  /  20 Page

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    K4S561632E-UC75 K4S561632E-UL75 K4S561632E-UL60 K4S561632E-UC60 K4S560832E-UC75 K4S560832E-UL75 K4S560432E-UC K4S560432E

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S561632E-UC75 K4S561632E-UL75 K4S561632E-UL60 K4S561632E-UC60 K4S560832E-UC75 K4S560832E-UL75 K4S560432E-UC K4S560432E-UC75 K4S560432E-UL75
OCR Text ... 1.1 (August. 2003) - Corrected typo in Page #8, 9 Revision 1.2 (May. 2004) - Added Note 5. sentense of tRDL parameter Revision 1.3 (August. 2004) - Corrected typo. CMOS SDRAM Rev. 1.3 August 2004 SDRAM 256Mb E-die (x4, x8, x16) ...
Description 256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) 256Mb的电子芯片与内存规格4 TSOP-II免费(符合RoHS

File Size 196.27K  /  14 Page

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    M383L3223ETS M383L6420ETS M383L2828ET1 M383L6423ETS M312L6420ETS M312L6423ETS M312L2828ET0 M312L3223ETS

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. M383L3223ETS M383L6420ETS M383L2828ET1 M383L6423ETS M312L6420ETS M312L6423ETS M312L2828ET0 M312L3223ETS
OCR Text ... 1.2 (August, 2003) - Corrected typo. Revision 1.3 (January, 2004) - Corrected typo in functional block diagram of 1GB DIMM Revision 1.4 (February, 2004) - Corrected functional block diagram of 1GB DIMM DDR SDRAM Revision 1.4 February...
Description DDR SDRAM Registered Module

File Size 446.08K  /  23 Page

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For typo Found Datasheets File :: 753    Search Time::1.265ms    
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