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  PTT-1617 Datasheet PDF File

For PTT-1617 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    FMP1617DAX

FIDELIX
Part No. FMP1617DAX
Description 1M x 16 bit Super Low Power and Low Voltage Full CMOS RAM

File Size 156.35K  /  11 Page

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Amphenol Communications Solutions

Part No. 87061-617
Description Quickie®, Wire to Board Connector, Double Row, 68 Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0494631617 49463-1617

Molex Electronics Ltd.
Part No. 0494631617 49463-1617
Description 2.00mm (0.078) LCD Housing Assembly, Single Row, 16 Circuits
MOLEX Connector

File Size 249.58K  /  3 Page

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Amphenol Communications Solutions

Part No. GSB3116175KHR
Description USB 3.2, Type A, Receptacle, Upright Reverse, 9 Pins, Shell Dip with Nickel Plating, Gold Flash, Dip 1.9mm, Blue High Temperature Housing, Tray Packaging
Tech specs    

Official Product Page

    MAX1617MEE MAX1617

MAXIM - Dallas Semiconductor
MAXIM[Maxim Integrated Products]
Part No. MAX1617MEE MAX1617
Description Remote/Local Temperature Sensor with SMBus Serial Interface

File Size 224.54K  /  20 Page

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Amphenol Communications Solutions

Part No. 54122-109161700LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0877601617 87760-1617

Molex Electronics Ltd.
Part No. 0877601617 87760-1617
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.17K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-109161700LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0873811617 87381-1617

Molex Electronics Ltd.
Part No. 0873811617 87381-1617
Description 2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Top Entry, 0.76μm (30μ) Gold (Au) Plating, without Cap, with Locating Peg, 16 Circuits, Leadfree

File Size 113.91K  /  3 Page

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Amphenol Communications Solutions

Part No. 98426-G16-17-297LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 34 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    FMP1617DCX

FIDELIX
Part No. FMP1617DCX
Description 1M x 16 bit Super Low Power and Low Voltage Full CMOS RAM

File Size 148.90K  /  11 Page

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Amphenol Communications Solutions

Part No. 98426-S16-17-297LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 34 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    VC-2R8A24-1747S VC-24 VC-2R8A24-0897 VC-2R8A24-0897S VC-2R8A24-1167 VC-2R8A24-1202 VC-2R8A24-1559P VC-2R8A24-1617 VC-2R8

Fujitsu, Ltd.
Fujitsu Limited
Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
Fujitsu Microelectronics
Part No. VC-2R8A24-1747S VC-24 VC-2R8A24-0897 VC-2R8A24-0897S VC-2R8A24-1167 VC-2R8A24-1202 VC-2R8A24-1559P VC-2R8A24-1617 VC-2R8A24
Description ASSP for Mobile Telephone ASSP的移动电
VCO (800 to 2000 MHz) VCO, 1150 MHz - 1185 MHz
VCO (800 to 2000 MHz) 压控振荡器(800000兆赫

File Size 60.63K  /  15 Page

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Amphenol Communications Solutions

Part No. 54121-409161750LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Integrated Device Technology, Inc.
Part No. 5962-9161702MYX
Description 8K X 16 MULTI-PORT SRAM, 70 ns, QFP84 CAVITY UP, QFP-84

File Size 722.66K  /  21 Page

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Amphenol Communications Solutions

Part No. 87061-617LF
Description Quickie®, Wire to Board Connector, Double Row, 68 Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header 30u\\/0.76um GXT™ Mating Plating
Tech specs    

Official Product Page

    Intersil, Corp.
Analog Devices, Inc.
TE Connectivity, Ltd.
Microsemi, Corp.
Microchip Technology, Inc.
Part No. TTLDM-65 LPSLDM-65 LDM-ACT-70 SMLDM-TTL-25 MDLDM-TTL-75 MDLDM-TTL-500 MDLDM-TTL-450 MDLDM-TTL-40 MDLDM-TTL-25 MDLDM-TTL-200 MDLDM-TTL-175 MDLDM-TTL-100 LPSLDM-80 AELDM-TTL-200 AELDM-TTL-25 AELDM-TTL-175 AELDM-TTL-80 AELDM-TTL-75 AELDM-TTL-70 AELDM-TTL-40 AELDM-TTL-85 AELDM-TTL-90 LDM-ACT-95 AELDM-TTL-450 AELDM-TTL-500 SPTTLDM-85 AELDM-TTL-65 LCLDM-TTL-40
Description 3.3V Dual Micropower High-Side/Low-Side MOSFET Driver; Package: PDIP; No of Pins: 8; Temperature Range: 0°C to 70°C
Quad High Side Micropower MOSFET Driver with Internal Charge Pump; Package: SO; No of Pins: 16; Temperature Range: 0°C to 70°C
Tapped Delay Line 抽头延迟

File Size 153.62K  /  2 Page

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Amphenol Communications Solutions

Part No. RJMG201K16170ER
Description RJMG, Input output Connectors, 1x1 1000 base-T LED
Tech specs    

Official Product Page

   
Part No. DSP161738-TQFPL DSP161730-TQFPL
Description 16-BIT, 26.32 MHz, OTHER DSP, PQFP100
16-BIT, 66.67 MHz, OTHER DSP, PQFP100

File Size 5,994.25K  /  148 Page

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Amphenol Communications Solutions

Part No. 54122-411161750LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

For PTT-1617 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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