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  molybdenum Datasheet PDF File

For molybdenum Found Datasheets File :: 578    Search Time::2.438ms    
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    5962-9763401HXC

Analog Devices
Part No. 5962-9763401HXC
OCR Text ...lable in a hermetically sealed, molybdenum based hybrid package and is easily heatsink mountable. Three screening levels are available, including military SMD. 1. 120 W/cubic inch pulsed power density with an integral EMI filter 2. Ultra...
Description 28 V 200 W Pulsed DC/DC Converter with Integral EMI Filter

File Size 294.13K  /  21 Page

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    S30S45CR S30S40CR S30S60CR S30S30CR S30S35CR S30S50CR

Mospec Semiconductor, Corp.
MOSPEC[Mospec Semiconductor]
Part No. S30S45CR S30S40CR S30S60CR S30S30CR S30S35CR S30S50CR
OCR Text molybdenum barrier metal. These state-of-the-art devices have the following features: * Low Forward Voltage. * Low Switching noise. * High Current Capacity * Guarantee Reverse Avalanche. * Guard-Ring for Stress Protection. * Low Power Loss ...
Description SCHOTTKY BARRIER RECTIFIERS 肖特

File Size 72.91K  /  2 Page

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    HMC424

HITTITE[Hittite Microwave Corporation]
Part No. HMC424
OCR Text ... die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should be brought as close to the die as possible in order to minimize bond wire length. Typica...
Description 0.5dB LSB GaAs MMIC 6-BIT DIGITAL ATTENUATOR/ DC - 13 GHz
0.5dB LSB GaAs MMIC 6-BIT DIGITAL ATTENUATOR, DC - 13 GHz

File Size 210.28K  /  6 Page

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    HMC425

Hittite Microwave Corporation
Part No. HMC425
OCR Text ... die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should be brought as close to the die as possible in order to minimize bond wire length. Typica...
Description 0.5 dB LSB GaAs MMIC 6-BIT DIGITAL POSITIVE CONTROL ATTENUATOR, 2.4 - 8.0 GHz

File Size 201.16K  /  6 Page

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    5962-9570701HXC

Analog Devices
Part No. 5962-9570701HXC
OCR Text ...ades use a hermetically sealed, molybdenum based hybrid package. Three screening levels are available, including military SMD. 1. Up to 60 W/cubic inch power density with an integral EMI filter designed to meet all applicable requirement...
Description 28 V/66 W/100 W DC/DC Converters with Integral EMI Filter

File Size 247.91K  /  19 Page

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    HMC330

Hittite Microwave Corpo...
Hittite Microwave Corporation
Part No. HMC330
OCR Text ... die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should be brought as close to the die as possible in order to minimize ribbon bond length. Typi...
Description GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 25 - 40 GHz

File Size 162.69K  /  6 Page

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    T1503NH

Eupec GmbH
Part No. T1503NH
OCR Text ...n NTV between silicon wafer and molybdenum Electroactive passivation by a - C:H Elektrische Eigenschaften / Electrical properties Hochstzulassige Werte / Maximum rated values Periodische Ruckwarts-Spitzensperrspannung repetitive peak...
Description T1503NH75 - 80 TOH

File Size 118.48K  /  8 Page

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    HMC260

Hittite Microwave Corporation
Part No. HMC260
OCR Text ... die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should be brought as close to the die as possible in order to minimize ribbon bond length. Typi...
Description GaAs MMIC FUNDAMENTAL MIXER, 14 - 26 GHz

File Size 177.44K  /  6 Page

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    HMC262

Hittite Microwave Corporation
Part No. HMC262
OCR Text ... die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. Typical d...
Description GaAs MMIC LOW NOISE AMPLIFIER 15 - 24 GHz

File Size 118.85K  /  6 Page

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    HMC263

Hittite Microwave Corporation
Part No. HMC263
OCR Text ... die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. Typical d...
Description GaAs MMIC LOW NOISE AMPLIFIER, 24 - 36 GHz

File Size 209.77K  /  8 Page

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For molybdenum Found Datasheets File :: 578    Search Time::2.438ms    
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