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Amphenol Communications Solutions |
| Part No. |
98401-801-28LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 28 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
98401-801A34LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
98401-801-50LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
98401-801-20LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87180-184C
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| Description |
Modular Jack, CAT 3, Low Profile, 8P4C, Right Angle, Through Mount, Without Shield, Snap Peg, 1 Port
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Official Product Page
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ALSC[Alliance Semiconductor Corporation] Alliance Semiconductor, Corp.
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| Part No. |
AS80M1801 AS80M1800
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| Description |
7 to 20 V, EMI reduction IC for switching power supply From old datasheet system EMI Reduction IC for Switching Power Supplies 电磁干扰降低集成电路开关电
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| File Size |
26.06K /
2 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
77311-801-02LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 02 Positions, 2.54 mm Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-801-18LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
44432-1801 0444321801
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| Description |
3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits, Tin (Sn) Plating 3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits, Tin (Sn) Plating
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| File Size |
224.08K /
5 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
77311-801-35LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-801-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 06 Positions, 2.54 mm Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-801-30LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch.
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Official Product Page
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