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  90136-2109 Datasheet PDF File

For 90136-2109 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    0901361332

Molex Electronics Ltd.
Part No. 0901361332
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 32 Circuits 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.41K  /  5 Page

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0901361304 90136-1304

Molex Electronics Ltd.
Part No. 0901361304 90136-1304
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 159.51K  /  4 Page

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0901361310 90136-1310

Molex Electronics Ltd.
Part No. 0901361310 90136-1310
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 159.51K  /  4 Page

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901361312 90136-1312

Molex Electronics Ltd.
Part No. 0901361312 90136-1312
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 159.39K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-109160800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901361315 90136-1315

Molex Electronics Ltd.
Part No. 0901361315 90136-1315
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 15 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 159.40K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-109241850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901361318 90136-1318

Molex Electronics Ltd.
Part No. 0901361318 90136-1318
Description 2.54mm (.100) Pitch C-Grid III?Header, Single Row, Vertical, Shrouded, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 159.40K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-109121400LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901361309

Molex Electronics Ltd.
Part No. 0901361309
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 9 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 159.39K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-109101700LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 10 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0901361308 90136-1308

Molex Electronics Ltd.
Part No. 0901361308 90136-1308
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 159.51K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-109201250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0901361307 90136-1307

Molex Electronics Ltd.
Part No. 0901361307 90136-1307
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 7 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 159.50K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-109721650LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0901361306 90136-1306

Molex Electronics Ltd.
Part No. 0901361306 90136-1306
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 159.39K  /  4 Page

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Amphenol Communications Solutions

Part No. 91931-32109LF
Description Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Vertical Receptacle, Surface Mount, 9 Positions.
Tech specs    

Official Product Page

For 90136-2109 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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