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  90136-1109 Datasheet PDF File

For 90136-1109 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    0901362332 90136-2332

Molex Electronics Ltd.
Part No. 0901362332 90136-2332
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0901362330 90136-2330

Molex Electronics Ltd.
Part No. 0901362330 90136-2330
Description 2.54mm (.100) Pitch C-Grid III?Header, Single Row, Right Angle, Shrouded, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.50K  /  5 Page

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    90136-2304 0901362304

Molex Electronics Ltd.
Part No. 90136-2304 0901362304
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.43K  /  5 Page

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901361108 90136-1108

Molex Electronics Ltd.
Part No. 0901361108 90136-1108
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 8 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 8 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.33K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1109LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 9 Positions, 2.54 mm Pitch, Right Angle
Tech specs    

Official Product Page

    90136-1203 0901361203

Molex Electronics Ltd.
Part No. 90136-1203 0901361203
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 3 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 85674-1109LF
Description Metral® Board Connectors, Backplane Connectors, 5 Row Signal Header, Straight, Press-Fit, Wide body, 1 Mod.
Tech specs    

Official Product Page

    0901361107 90136-1107

Molex Electronics Ltd.
Part No. 0901361107 90136-1107
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 7 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 7 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 68001-109HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 9 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-2305 0901362305

Molex Electronics Ltd.
Part No. 90136-2305 0901362305
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 5 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 5 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.43K  /  5 Page

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Amphenol Communications Solutions

Part No. 54121-109051650LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901362209 90136-2209

Molex Electronics Ltd.
Part No. 0901362209 90136-2209
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 9 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 254.60K  /  5 Page

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Amphenol Communications Solutions

Part No. 68461-109HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 9 Positions, 2.54 mm Pitch, Right Angle, 10.16 mm (0.4 in.) Mating, 8.13 mm (0.32 in.) Tail
Tech specs    

Official Product Page

    90136-2308 0901362308

Molex Electronics Ltd.
Part No. 90136-2308 0901362308
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.33K  /  5 Page

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Amphenol Communications Solutions

Part No. 78511-109HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 9 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0901361105 90136-1105

Molex Electronics Ltd.
Part No. 0901361105 90136-1105
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 5 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 5 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.33K  /  4 Page

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Amphenol Communications Solutions

Part No. 91932-31109LF
Description Conan® 1.00mm Connector, Board to Board connector, I - Industrial Series, Vertical Receptacle, Surface Mount, 9 Positions, 1.00mm ( 0.039in) Pitch.
Tech specs    

Official Product Page

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