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  76155-0114 Datasheet PDF File

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    T8304DX 0011-40-2265 1140-2265 001140-2265

Molex Electronics Ltd.
Part No. T8304DX 0011-40-2265 1140-2265 001140-2265
Description Terminator Die

File Size 21.20K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SPC660114

SYNC POWER Crop.
Part No. SPC660114
Description N & P Pair Enhancement Mode MOSFET

File Size 288.65K  /  11 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    69802 T05-0017 T05-0114 T05-0212 T11-0002 T03-0452 T06-0070

FCI connector
Part No. 69802 T05-0017 T05-0114 T05-0212 T11-0002 T03-0452 T06-0070
Description PLCC SMT SOCKET
   PLCC SMT Socket

File Size 443.62K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114828-10114LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    704001144

Molex Electronics Ltd.
Part No. 704001144
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version D, Back Ribs, Wire Size 24, 0.76μm (30μ) Gold (Au), 25 Circuits

File Size 153.74K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114830-10114LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
Tech specs    

Official Product Page

   
Part No. UPD720114
Description MOS INTEGRATED CIRCUIT

File Size 282.47K  /  31 Page

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Amphenol Communications Solutions

Part No. 10114508-D0J-20DLF
Description XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
Tech specs    

Official Product Page

    Axiomtek Co., Ltd.
Part No. CAPA80114
Description PCI Express Mini Card expansion
   PCI Express Mini Card expansion

File Size 501.32K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114828-10102LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions
Tech specs    

Official Product Page

   
Part No. BUF-001146882
Description PH BUFFER TABLETS Inhalt pro Packung: 15 Stk.

File Size 99.24K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114868-L0J-10DLF
Description XCede® High Speed Backplane Connectors, 3 wall left header.
Tech specs    

Official Product Page

    M50-360-142 M50-36011 M50-3601142 M50-3603042

Harwin Plc
Part No. M50-360-142 M50-36011 M50-3601142 M50-3603042
Description 1.27mm Pitch DIL Vertical SMT Pin Header, selective gold tin, 11 11-way 22 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT
1.27mm Pitch DIL Vertical SMT Pin Header, selective gold tin, 30 30-way 60 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT

File Size 45.67K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114508-00J-20DLF
Description XCede® High Speed Backplane Connectors, 2 wall header.
Tech specs    

Official Product Page

    2SD1662 E001149

TOSHIBA[Toshiba Semiconductor]
Part No. 2SD1662 E001149
Description From old datasheet system
NPN TRIPLE DIFFUSED TYPE (HIGH CURRENT SWITCHING APPLICATIONS)

File Size 163.70K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114492-008LF
Description HPCE R/A REC 32P24S
Tech specs    

Official Product Page

    2SD1631 E001147

TOSHIBA[Toshiba Semiconductor]
Part No. 2SD1631 E001147
Description From old datasheet system
NPN EPITAXIAL TYPE (MICRO MOTOR DRIVE HAMMER DRIVE SWITCHING POWER AMPLIFIER APPLICATIONS)
NPN EPITAXIAL TYPE (MICRO MOTOR DRIVE, HAMMER DRIVE, SWITCHING, POWER AMPLIFIER APPLICATIONS)

File Size 188.79K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114868-10J-10DLF
Description XCede® High Speed Backplane Connectors, 4 wall header.
Tech specs    

Official Product Page

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