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  75838-0705 Datasheet PDF File

For 75838-0705 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    0705430118

Molex Electronics Ltd.
Part No. 0705430118
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 77315-107-05LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 5 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0705430119

Molex Electronics Ltd.
Part No. 0705430119
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 15Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.16K  /  4 Page

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Amphenol Communications Solutions

Part No. 66207-051LF
Description Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), Vertical, Eject Latch Header 30u\\/0.76um Au/GXT Plating.
Tech specs    

Official Product Page

    0705430120

Molex Electronics Ltd.
Part No. 0705430120
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 16 Circuits, 0.76um

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 66207-056LF
Description Quickie Header, Wire to Board Connector, Double Row, 50 Positions, 2.54 mm (0.1 in.), Vertical, Eject Latch Header 30u\\/0.76um Au/GXT Plating.
Tech specs    

Official Product Page

    0705430121

Molex Electronics Ltd.
Part No. 0705430121
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 17Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 54111-807051000LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0705430122

Molex Electronics Ltd.
Part No. 0705430122
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-407051300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0705430123

Molex Electronics Ltd.
Part No. 0705430123
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 19Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68000-705HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 5 Positions, 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

    0705430124

Molex Electronics Ltd.
Part No. 0705430124
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 20 Circuits, 0.76um (30u)

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-807051300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0705430125

Molex Electronics Ltd.
Part No. 0705430125
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 21Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-807051050LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    70543-0007 0705430007

Molex Electronics Ltd.
Part No. 70543-0007 0705430007
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 8Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 54111-107050800LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    705-51-0019 0705510019

Molex Electronics Ltd.
Part No. 705-51-0019 0705510019
Description 2.54mm (.100) Pitch SL Header, Single Row, Right Angle, .120 Pocket, Shrouded, with Beveled Plastic Peg, 20 Circuits, Tin (Sn) Plating

File Size 299.56K  /  4 Page

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Amphenol Communications Solutions

Part No. 59202-T26-07-054LF
Description Minitek® 2.00mm, Board to Board Connector, Unshrouded Stacking Header - Surface Mount - Double row - 14 Positions - 2mm (0.079inch) - Vertical.
Tech specs    

Official Product Page

For 75838-0705 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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