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  71308-5452 Datasheet PDF File

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    71308-5440 0713085440

Molex Electronics Ltd.
Part No. 71308-5440 0713085440
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 40 Circuits

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 10080054-527LF
Description Quickie Header, Wire to Board Connector, Double Row, 34 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    71308-5442 0713085442

Molex Electronics Ltd.
Part No. 71308-5442 0713085442
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 42 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. RJE1R288325452
Description Modular Jacks, Input Output Connectors, 8P8C, Cat6 over Cat5e, Stacked, Shield, With LEDs
Tech specs    

Official Product Page

    71308-5444 0713085444

Molex Electronics Ltd.
Part No. 71308-5444 0713085444
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 44 Circuits, 1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator Pegs

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 10124054-520LF
Description Rib-Cage® ,Board-To-Board Connector, Through Mount Right Angle Shrouded PCB Header, 40 Positions, Holddown Mounting style.
Tech specs    

Official Product Page

    71308-5446 0713085446

Molex Electronics Ltd.
Part No. 71308-5446 0713085446
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 46 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 87545-2211LF
Description Modular Jack, CAT 3, Standard, 6P6C, Vertical, Surface Mount, without Shield, 1 Port.
Tech specs    

Official Product Page

    71308-5448 0713085448

Molex Electronics Ltd.
Part No. 71308-5448 0713085448
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 48 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB LocatorPegs

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 10080054-521LF
Description Quickie Header, Wire to Board Connector, Double Row, 14 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs    

Official Product Page

    71308-5450 0713085450

Molex Electronics Ltd.
Part No. 71308-5450 0713085450
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 50 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 10080054-523LF
Description Quickie Header, Wire to Board Connector, Double Row, 20 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs    

Official Product Page

    71308-5454 0713085454

Molex Electronics Ltd.
Part No. 71308-5454 0713085454
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 54 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.55K  /  8 Page

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Amphenol Communications Solutions

Part No. 10080054-524LF
Description Quickie Header, Wire to Board Connector, Double Row, 24 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs    

Official Product Page

    71308-5456 0713085456

Molex Electronics Ltd.
Part No. 71308-5456 0713085456
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 56 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.55K  /  8 Page

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Amphenol Communications Solutions

Part No. 68695-452HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Double Row, 52 Positions, 2.54mm Pitch, Right Angle, 5.84mm (0.23in) Mating, 2.29mm (0.09in) Tail.
Tech specs    

Official Product Page

    0713086474

Molex Electronics Ltd.
Part No. 0713086474
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 74 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 74 Circuits1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30m

File Size 1,475.71K  /  8 Page

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Amphenol Communications Solutions

Part No. 68405-452HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 52 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0713086476

Molex Electronics Ltd.
Part No. 0713086476
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 76 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 76 Circuits1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30m

File Size 1,475.71K  /  8 Page

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Amphenol Communications Solutions

Part No. 10080054-525LF
Description Quickie Header, Wire to Board Connector, Double Row, 26 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs    

Official Product Page

For 71308-5452 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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