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  71308-5408 Datasheet PDF File

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    0713086418 71308-6418

Molex Electronics Ltd.
Part No. 0713086418 71308-6418
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 18 Circuits, 1.50μm (59u) Minimum

File Size 1,475.56K  /  8 Page

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Rochester Electronics LLC

Part No. 5408/BCA
Description 5408 - AND GATE, QUAD 2-INPUT - Dual marked (M38510/01601BCA)
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0713086426 71308-6426

Molex Electronics Ltd.
Part No. 0713086426 71308-6426
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 26 Circuits

File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions

Part No. 79425-408HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 8 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    0713086430 71308-6430

Molex Electronics Ltd.
Part No. 0713086430 71308-6430
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 30 Circuits, 1.50um (59u) Minimum

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. U90B2054081210
Description ExpressPort QSFP+, High Speed Input Output Connectors, QSFP STACKED COMBO.
Tech specs    

Official Product Page

    0713086432 71308-6432

Molex Electronics Ltd.
Part No. 0713086432 71308-6432
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 32 Circuits, 1.50um (59u) Minimum

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 75915-408LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Single Row, Top Entry, 8 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0713086438 71308-6438

Molex Electronics Ltd.
Part No. 0713086438 71308-6438
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 38 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)

File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions

Part No. U95Z1054081321
Description QSFP STACKED COMBO W LP
Tech specs    

Official Product Page

    0713086448 71308-6448

Molex Electronics Ltd.
Part No. 0713086448 71308-6448
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 48 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130) PCB Locator Pegs

File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions

Part No. U95Z1054081341
Description QSFP STACKED COMBO W LP
Tech specs    

Official Product Page

    0713086424 71308-6424

Molex Electronics Ltd.
Part No. 0713086424 71308-6424
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 24 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130) PCB Locator Pegs

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. U95Z2054081321
Description QSFP 2X2 COMBO LP AND SPFG
Tech specs    

Official Product Page

    0713086450 71308-6450

Molex Electronics Ltd.
Part No. 0713086450 71308-6450
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 50 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. U90B1054081100
Description ExpressPort QSFP+, High Speed Input Output Connectors, QSFP PLUS STACKED COMBO.
Tech specs    

Official Product Page

    0713086446 71308-6446

Molex Electronics Ltd.
Part No. 0713086446 71308-6446
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 46 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)

File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions

Part No. 10136654-0822LF
Description Minitek® Pwr 3.0, Single Row, Right Angle Through Hole Header, Gold Flash plating, 8 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    0713086414 71308-6414

Molex Electronics Ltd.
Part No. 0713086414 71308-6414
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 14 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. U95Z1054081301
Description QSFP STACKED COMBO W LP
Tech specs    

Official Product Page

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