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  47151-8061 Datasheet PDF File

For 47151-8061 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    0780610051

Molex Electronics Ltd.
Part No. 0780610051
Description 1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38μm (15μ) Gold(Au) Selective Plating, 240 Circuits

File Size 361.79K  /  7 Page

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Amphenol Communications Solutions

Part No. 75160-806-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,10 position, 2.54mm pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0530480610 53048-0610

Molex Electronics Ltd.
Part No. 0530480610 53048-0610
Description 1.25mm (.049) Pitch PicoBlade?/a> Header, Right Angle, 6 Circuits
MOLEX Connector

File Size 86.04K  /  3 Page

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Amphenol Communications Solutions

Part No. 54242-806100950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0923180614

Molex Electronics Ltd.
Part No. 0923180614
Description Picoflex PF-50 IDT-Board In Z-Style, 6 Circuits, 0.14m (5.51") Length

File Size 98.69K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-806161250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    FODM8061 FODM8061R2

Fairchild Semiconductor
Part No. FODM8061 FODM8061R2
Description High Noise Immunity, 3.3V/5V, 10Mbit/sec Logic Gate Output (Open Collector) Optocoupler

File Size 375.45K  /  12 Page

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Amphenol Communications Solutions

Part No. 68020-408-061033LF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0923180612

Molex Electronics Ltd.
Part No. 0923180612
Description Picoflex PF-50 IDT-Board In Z-Style, 6 Circuits, 0.12m (4.72") Length

File Size 98.70K  /  2 Page

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Amphenol Communications Solutions

Part No. 59112-T3806-1400LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 6 Positions.
Tech specs    

Official Product Page

    0923180610

Molex Electronics Ltd.
Part No. 0923180610
Description Picoflex PF-50 IDT-Board In Z-Style, 6 Circuits, 0.10m (3.94") Length

File Size 98.69K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-808061500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    FODM806110

Fairchild Semiconductor
Part No. FODM806110
Description High Noise Immunity, 3.3V/5V, 10Mbit/sec Logic Gate Output (Open Collector) Optocoupler

File Size 380.67K  /  12 Page

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Amphenol Communications Solutions

Part No. 54112-806161000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    78061-0012 0780610012

Molex Electronics Ltd.
Part No. 78061-0012 0780610012
Description 1.00mm (.039") Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.76um (30u") Gold(Au) Selective Plating
1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.76um (30u) Gold(Au) Selective Plating

File Size 361.93K  /  7 Page

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Amphenol Communications Solutions

Part No. 54121-806140900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    78061-0011 0780610011

Molex Electronics Ltd.
Part No. 78061-0011 0780610011
Description 1.00mm (.039") Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.76渭m (30渭") Gold(Au) Selective Plating, 240 Circuits
1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.76μm (30μ) Gold(Au) Selective Plating, 240 Circuits

File Size 361.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 54122-806140850LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    78061-0002 0780610002

Molex Electronics Ltd.
Part No. 78061-0002 0780610002
Description 1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38渭m (15渭) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins
1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38μm (15μ) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins

File Size 361.81K  /  7 Page

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Amphenol Communications Solutions

Part No. 10142708-06100LF
Description Minitek®Pwr 5.7, Vertical Through Hole Header, Dual Row, Black Color, 6 Positions, 15u\\ Gold (100u\\ Tin on Tails) plating, GW Compatible LCP, With Pegs, Tray.
Tech specs    

Official Product Page

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