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  42410-6408 Datasheet PDF File

For 42410-6408 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K9S6408V0A-SSB0
Description 8M x 8 Bit SmartMediaTM Card
File Size 351.39K  /  26 Page

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Amphenol Communications Solutions
Part No. 76342-410LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Top Entry, Double Row , 20 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

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HUA FENG CIRCUIT





    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K9F6408U0A-TCB0
Description TV 32C 32#20 SKT RECP 8米8位NAND闪存
File Size 350.56K  /  26 Page

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Amphenol Communications Solutions
Part No. 77313-424-10LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 10 Positions
Tech specs 　 　

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Part No. K4F640812E-JI50
Description 8M X 8 FAST PAGE DRAM, 50 ns, PDSO32
File Size 175.24K  /  20 Page

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Amphenol Communications Solutions
Part No. 77315-424-10LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 10 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    K4S640832C K4S640832C-TC_L1L K4S640832C-TC_L70 K4S640832C-TC_L80 K4S640832C-TC_L1H K4S640832C-TC_L10 K4S640832C-TC/L10 K

SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S640832C K4S640832C-TC_L1L K4S640832C-TC_L70 K4S640832C-TC_L80 K4S640832C-TC_L1H K4S640832C-TC_L10 K4S640832C-TC/L10 K4S640832C-TC/L1H K4S640832C-TC/L1L K4S640832C-TC/L70 K4S640832C-TC/L80
Description 64Mbit SDRAM 2M x 8Bit x 4 Banks Synchronous DRAM LVTTL
File Size 128.76K  /  11 Page

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Amphenol Communications Solutions
Part No. 76342-410HLF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Top Entry, Double Row , 20 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    K4S640832D K4S640832D-TC_L10 K4S640832D-TC_L1H K4S640832D-TC_L1L K4S640832D-TC_L80 K4S640832D-TC_L75 K4S640832D-TC/L10 K

SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S640832D K4S640832D-TC_L10 K4S640832D-TC_L1H K4S640832D-TC_L1L K4S640832D-TC_L80 K4S640832D-TC_L75 K4S640832D-TC/L10 K4S640832D-TC/L1H K4S640832D-TC/L1L K4S640832D-TC/L75 K4S640832D-TC/L80
Description 64Mbit SDRAM 2M x 8Bit x 4 Banks Synchronous DRAM LVTTL
File Size 127.15K  /  10 Page

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Amphenol Communications Solutions
Part No. 77311-424-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 10 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

   
Part No. K9F6408U0B-TCB00
Description
File Size 507.48K  /  27 Page

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Amphenol Communications Solutions
Part No. U10BH7424101W
Description SlimSAS Vertical X8 30u\\ Gold plating, Latch pin outside, Latch pin length=2.2mm, 24G, T&R packing, White color
Tech specs 　 　

Official Product Page

    K4S640832 K4S640832F K4S640832F-TL75 K4S640832F-TC75

SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Electronics Inc
Part No. K4S640832 K4S640832F K4S640832F-TL75 K4S640832F-TC75
Description Advanced LinCMOS(TM) Low-Noise Precision Operational Amplifier 8-SOIC 0 to 70
64Mbit SDRAM 2M x 8Bit x 4 Banks Synchronous DRAM LVTTL
IC,SDRAM,4X2MX8,CMOS,TSOP,54PIN,PLASTIC
File Size 116.51K  /  11 Page

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Amphenol Communications Solutions
Part No. U10BH7424101T
Description SlimSAS Vertical X8 30u\\ Gold plating, Latch pin outside, Latch pin length=2.2mm, 24G, T&R packing
Tech specs 　 　

Official Product Page

    Everlight Electronics Co., ...
Part No. XUAN1313-KM357P1-36408
Description XUAN 1313 36V/8W series
File Size 1,083.38K  /  24 Page

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Amphenol Communications Solutions
Part No. 87606-408LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 16 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

   
Part No. K4F640812D-JI45 K4F640812D-JP45
Description 8M X 8 FAST PAGE DRAM, 45 ns, PDSO32
File Size 175.15K  /  20 Page

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Amphenol Communications Solutions
Part No. 54122-811640800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 64 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    K9F6408U0A-TCB0 K9F6408U0A-TIB0

SAMSUNG[Samsung semiconductor]
Samsung Electronics Inc
Part No. K9F6408U0A-TCB0 K9F6408U0A-TIB0
Description From old datasheet system
EEPROM,NAND FLASH,8MX8,CMOS,TSOP,44PIN,PLASTIC
8M x 8 Bit NAND Flash Memory
File Size 344.78K  /  26 Page

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Amphenol Communications Solutions
Part No. 54122-806640800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 64 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

For 42410-6408 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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