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  39860-0705 Datasheet PDF File

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    1709070500

AAEON Technology
Part No. 1709070500
Description PICO-ITX Board with 7th Gen. Intel Core i7/i5/i3/Celeron U-Series SoC

File Size 693.45K  /  2 Page

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Amphenol Communications Solutions

Part No. RJCSE398601
Description Modular Jack - 8P8C, Right Angle, Surface Mount, Single Port, Shield With Top and Side EMI Tabs and PCB Tabs, With LEDs
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0705430118

Molex Electronics Ltd.
Part No. 0705430118
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 77315-107-05LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 5 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0705430117

Molex Electronics Ltd.
Part No. 0705430117
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 13Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 66207-051LF
Description Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), Vertical, Eject Latch Header 30u\\/0.76um Au/GXT Plating.
Tech specs    

Official Product Page

    0705430114

Molex Electronics Ltd.
Part No. 0705430114
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 10 Circuits, 0.76um

File Size 418.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 66207-056LF
Description Quickie Header, Wire to Board Connector, Double Row, 50 Positions, 2.54 mm (0.1 in.), Vertical, Eject Latch Header 30u\\/0.76um Au/GXT Plating.
Tech specs    

Official Product Page

    0705430113

Molex Electronics Ltd.
Part No. 0705430113
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 9Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 54111-807051000LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0705430112

Molex Electronics Ltd.
Part No. 0705430112
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 8Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-407051300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0705430111

Molex Electronics Ltd.
Part No. 0705430111
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 7Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68000-705HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 5 Positions, 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

    705-51-0007 0705510007

Molex Electronics Ltd.
Part No. 705-51-0007 0705510007
Description 2.54mm (.100) Pitch SL Header, Single Row, Right Angle, .120 Pocket, Shrouded, with Beveled Plastic Peg, 8 Circuits, Tin (Sn) Plating

File Size 299.60K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-807051300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0705430109

Molex Electronics Ltd.
Part No. 0705430109
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded34 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs

File Size 418.27K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-807051050LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0705430108

Molex Electronics Ltd.
Part No. 0705430108
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 4Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.27K  /  4 Page

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Amphenol Communications Solutions

Part No. 54111-107050800LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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