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  39170-2125 Datasheet PDF File

For 39170-2125 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    RF2125 RF2125PCBA

RFMD[RF Micro Devices]
Part No. RF2125 RF2125PCBA
Description HIGH POWER LINEAR AMPLIFIER

File Size 103.73K  /  6 Page

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Amphenol Communications Solutions

Part No. 68739-170HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 70 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Taiyo Yuden (U.S.A.), I...
Part No. LK21251R0K-T
Description Multilayer Chip Inductors (LK series)

File Size 129.87K  /  1 Page

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Amphenol Communications Solutions

Part No. 93939-170HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 70 Positions, 2.54 mm Pitch, Right Angle, 4.06 mm (0.16in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    Taiyo Yuden (U.S.A.), I...
Part No. CK2125R47M-T
Description Multilayer Chip Inductors

File Size 129.65K  /  1 Page

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Amphenol Communications Solutions

Part No. 68021-252HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 52 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Taiyo Yuden (U.S.A.), I...
Part No. LK21252R7M-T
Description Multilayer Chip Inductors (LK series)

File Size 131.66K  /  1 Page

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Amphenol Communications Solutions

Part No. 68002-125HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 25 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Taiyo Yuden (U.S.A.), I...
Part No. LK21251R8M-T
Description Multilayer Chip Inductors (LK series)

File Size 131.66K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-128121250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 12 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    Taiyo Yuden (U.S.A.), I...
Part No. LK21251R8K-T
Description Multilayer Chip Inductors (LK series)

File Size 129.63K  /  1 Page

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Amphenol Communications Solutions

Part No. 91931-22125LF
Description Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Vertical Receptacle, Surface Mount, 25 Positions.
Tech specs    

Official Product Page

    Taiyo Yuden (U.S.A.), I...
Part No. LK21251R0M-T
Description Multilayer Chip Inductors (LK series)

File Size 129.63K  /  1 Page

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Amphenol Communications Solutions

Part No. 91921-32125LF
Description Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Vertical Receptacle, Surface Mount, 25 Positions.
Tech specs    

Official Product Page

    CPC2125N CPC2125NTR

IXYS Corporation
Part No. CPC2125N CPC2125NTR
Description Dual Single-Pole, Normally Closed 8-Pin SOIC OptoMOS? Relay

File Size 118.17K  /  6 Page

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Amphenol Communications Solutions

Part No. 88902-125LF
Description 5 Row Signal Header, Straight, Press-Fit, Wide body, 30 Position
Tech specs    

Official Product Page

    Taiyo Yuden (U.S.A.), I...
Part No. HK2125R39J-TV
Description    High Frequency Multilayer Chip Inductors for Automotive

File Size 129.97K  /  1 Page

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Amphenol Communications Solutions

Part No. 85674-2125LF
Description 5 Row Signal Header, Straight, Press-Fit, Wide body, 1 Mod
Tech specs    

Official Product Page

    Taiyo Yuden (U.S.A.), I...
Part No. HK2125R12J-TV
Description    High Frequency Multilayer Chip Inductors for Automotive

File Size 129.97K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-428121250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 12 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

For 39170-2125 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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