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  39170-1116 Datasheet PDF File

For 39170-1116 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    NJG1116HB3

New Japan Radio
Part No. NJG1116HB3
Description 2.1GHz Band LNA GaAs MMIC

File Size 350.12K  /  14 Page

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Amphenol Communications Solutions

Part No. 68739-170HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 70 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0760111635-17

Molex Electronics Ltd.
Part No. 0760111635-17
Description GbX I-Trac Right Angle Header Module, 1.85mm by 3.70mm Pitch, Unguided

File Size 33.59K  /  2 Page

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Amphenol Communications Solutions

Part No. 93939-170HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 70 Positions, 2.54 mm Pitch, Right Angle, 4.06 mm (0.16in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    87792-1116 0877921116

Molex Electronics Ltd.
Part No. 87792-1116 0877921116
Description 2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 16 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging

File Size 469.69K  /  9 Page

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Amphenol Communications Solutions

Part No. 70298-1116LF
Description 4 Row Signal Header, 48 Position, Straight, Press-Fit, Wide body
Tech specs    

Official Product Page

    90571-1163 0905711163

http://
Molex Electronics Ltd.
Part No. 90571-1163 0905711163
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 16 Circuits, 0.25 μm Gold (Au)
2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 16 Circuits, 0.25 μm Gold (Au)

File Size 282.78K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-811161900LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87911-1611 0879111611

Molex Electronics Ltd.
Part No. 87911-1611 0879111611
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 16 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free

File Size 360.87K  /  6 Page

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Amphenol Communications Solutions

Part No. 77311-162-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    Samsung Semiconductor Co., Ltd.
Part No. KS57C21116
Description 4-BIT CMOS Microcontroller(4位微控制 4位CMOS微控制器4位微控制器)

File Size 46.59K  /  7 Page

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Amphenol Communications Solutions

Part No. 68021-116HTLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0736441116

Molex Electronics Ltd.
Part No. 0736441116
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position N/A, 144 Circuits

File Size 167.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 10111616-004LF
Description HPCE VERT REC 52P22S
Tech specs    

Official Product Page

    90571-1162 0905711162

http://
Molex Electronics Ltd.
Part No. 90571-1162 0905711162
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 16 Circuits, 0.76 μm Gold (Au)
2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 16 Circuits, 0.76 μm Gold (Au)

File Size 282.78K  /  4 Page

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Amphenol Communications Solutions

Part No. 68021-116
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0436501116

Molex Electronics Ltd.
Part No. 0436501116
Description
File Size 153.64K  /  3 Page

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Amphenol Communications Solutions

Part No. 54242-811162350LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901301116 90130-1116

Molex Electronics Ltd.
Part No. 0901301116 90130-1116
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 16 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 68691-116HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 39170-1116 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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