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  1140-2036 Datasheet PDF File

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    0011-40-4204 001140-4204

Molex Electronics Ltd.
Part No. 0011-40-4204 001140-4204
Description Conductor Anvil

File Size 15.98K  /  1 Page

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Amphenol Communications Solutions

Part No. 1140084168
Description 1140084168-Micro SD Normal Open H=1.55 NONE PUSH
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0011-40-4209 001140-4209

Molex Electronics Ltd.
Part No. 0011-40-4209 001140-4209
Description Insulation Anvil

File Size 11.51K  /  1 Page

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Amphenol Communications Solutions

Part No. 67292-036LF
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 72 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs    

Official Product Page

    001140-2193 0011-40-2193

Molex Electronics Ltd.
Part No. 001140-2193 0011-40-2193
Description Terminator Die

File Size 20.08K  /  1 Page

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Amphenol Communications Solutions

Part No. 61083-203600LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

    1140-4200 0011-40-4200 001140-4200

Molex Electronics Ltd.
Part No. 1140-4200 0011-40-4200 001140-4200
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 61083-203609LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

    0011-40-2192 1140-2192 001140-2192

Molex Electronics Ltd.
Part No. 0011-40-2192 1140-2192 001140-2192
Description Terminator Die

File Size 19.91K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-820-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0011-40-4324 001140-4324

Molex Electronics Ltd.
Part No. 0011-40-4324 001140-4324
Description Insulation Anvil

File Size 16.05K  /  1 Page

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Amphenol Communications Solutions

Part No. 75160-120-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,36 position, 2.54mm pitch
Tech specs    

Official Product Page

    11-40-4322 1140-4322 001140-4322 0011-40-4322

Molex Electronics Ltd.
Part No. 11-40-4322 1140-4322 001140-4322 0011-40-4322
Description Conductor Anvil

File Size 15.98K  /  1 Page

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Amphenol Communications Solutions

Part No. 61082-203602LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs    

Official Product Page

    114045-4567 1140-45-4567

Molex Electronics Ltd.
Part No. 114045-4567 1140-45-4567
Description Anvil

File Size 11.53K  /  1 Page

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Amphenol Communications Solutions

Part No. 61082-203609LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs    

Official Product Page

    0011-40-4205 1140-4205 001140-4205

Molex Electronics Ltd.
Part No. 0011-40-4205 1140-4205 001140-4205
Description Insulation Anvil

File Size 16.13K  /  1 Page

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Amphenol Communications Solutions

Part No. UE863G262020361
Description 2X2SFP ULTRAPORT W/H LP
Tech specs    

Official Product Page

    SPC Technology
Part No. WPPC-D12036AE-TLD
Description 1 CHANNEL DARLINGTON OUTPUT OPTOCOUPLER SMD, 6 PIN

File Size 287.71K  /  2 Page

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Amphenol Communications Solutions

Part No. UE86S442C20361
Description ExpressPort SFP+, High Speed Input Output Connectors, 2X4 SFP COMBO THERMAL.
Tech specs    

Official Product Page

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