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  0154.100 Datasheet PDF File

For 0154.100 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    15-45-3152 0015453152

Molex Electronics Ltd.
Part No. 15-45-3152 0015453152
Description 2.54mm (.100) Pitch C-Grid? PCB Connector, Surface Mount, High Profile, Dual Row, Vertical, 52 Circuits

File Size 736.20K  /  6 Page

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Amphenol Communications Solutions

Part No. 68015-415HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 15 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    15-45-3134 0015453134

Molex Electronics Ltd.
Part No. 15-45-3134 0015453134
Description 2.54mm (.100) Pitch C-Grid? PCB Connector, Surface Mount, High Profile, Dual Row, Vertical, 34 Circuits

File Size 736.20K  /  6 Page

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Amphenol Communications Solutions

Part No. 68015-410HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477550

Molex Electronics Ltd.
Part No. 0015477550
Description MOLEX Connector

File Size 377.42K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-406HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 6 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477570

Molex Electronics Ltd.
Part No. 0015477570
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 70 Circuits, Tin (Sn) Plating

File Size 377.35K  /  4 Page

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Amphenol Communications Solutions

Part No. 68020-154HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 54 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015474174

Molex Electronics Ltd.
Part No. 0015474174
Description
File Size 134.50K  /  3 Page

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Amphenol Communications Solutions

Part No. 68015-407HALF
Description BS SR RA HDR TR 1X7
Tech specs    

Official Product Page

    0015474240

Molex Electronics Ltd.
Part No. 0015474240
Description
File Size 151.15K  /  3 Page

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Amphenol Communications Solutions

Part No. 59202-G38-20-154LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 40 Positions.
Tech specs    

Official Product Page

    0015477562 15-47-7562

Molex Electronics Ltd.
Part No. 0015477562 15-47-7562
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 62 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 62 Circuits, Tin (Sn) Plating

File Size 377.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-401HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 1 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477648

Molex Electronics Ltd.
Part No. 0015477648
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-416HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 16 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477560 15-47-7560

Molex Electronics Ltd.
Part No. 0015477560 15-47-7560
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 60 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 60 Circuits, Tin (Sn) Plating

File Size 377.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-421HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 21 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477652

Molex Electronics Ltd.
Part No. 0015477652
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 52 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-424HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 24 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 0154.100 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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