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  TCM-3185 Datasheet PDF File

For TCM-3185 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    AB-RTCMK-32768KHZ

Abracon Corporation
Part No. AB-RTCMK-32768KHZ
Description Ultra low profile, 3.2 x 2.5 x 1.0 mm, Seam sealed SMT package

File Size 2,208.47K  /  5 Page

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Amphenol Communications Solutions

Part No. 77313-185-70LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 70 Positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Vishay
Part No. TCMT1105 TCMT1102
Description NPN-OUTPUT DC-INPUT OPTOCOUPLER,1-CHANNEL,3.75KV ISOLATION,SO

File Size 359.50K  /  9 Page

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Amphenol Communications Solutions

Part No. 131-8516-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    UTCM2950-3.0 UTCM2950-2.5 UTCM2950-3.3 UTCM2950-3.6 UTCM2950-5.0 UTCM2951 M2951 M2950 M2950-3.0 M2950-3.3 M2950-3.6 M295

UTC[Unisonic Technologies]
友顺科技股份有限公司
Unisonic Technologies Co., Ltd.
Part No. UTCM2950-3.0 UTCM2950-2.5 UTCM2950-3.3 UTCM2950-3.6 UTCM2950-5.0 UTCM2951 M2951 M2950 M2950-3.0 M2950-3.3 M2950-3.6 M2950-5.0 M2950-2.5
Description 250 mA LOW-DROPOUT VOLTAGE REGULATOR 250毫安低压差电压调节器

File Size 144.22K  /  7 Page

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Amphenol Communications Solutions

Part No. 77313-185-28LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 28 Positions
Tech specs    

Official Product Page

    Vishay
Part No. TCMT1106 TCMT1103
Description Optocouplers

File Size 394.57K  /  9 Page

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Amphenol Communications Solutions

Part No. 77313-185-08LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 08 Positions
Tech specs    

Official Product Page

   
Part No. TCM5053LU
Description IMAGE SENSOR-CMOS, 30fps, SQUARE, SURFACE MOUNT

File Size 202.44K  /  14 Page

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Amphenol Communications Solutions

Part No. 77313-185R08LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 08 Positions
Tech specs    

Official Product Page

    UTCMC4558

Unisonic Technologies
Part No. UTCMC4558
Description DUAL OPERATIONAL AMPLIFIER

File Size 110.50K  /  5 Page

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Amphenol Communications Solutions

Part No. 131-8516-21H
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left Polarized, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    MC4580 UTCMC4580

UTC[Unisonic Technologies]
Part No. MC4580 UTCMC4580
Description LINEAR INTEGRATED CIRCUIT

File Size 132.44K  /  5 Page

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Amphenol Communications Solutions

Part No. 77313-185-06LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 06 Positions
Tech specs    

Official Product Page

    Agere
Part No. TCMD0110G
Description Telecomm/Datacomm

File Size 232.47K  /  17 Page

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Amphenol Communications Solutions

Part No. 131-8514-21D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Left Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    TCM1210G-301-2P TCM1210G TCM1210G-201-2P TCM1210G-650-2P TCM1210G-900-2P TCM1210G-900-2P-T200

TDK Electronics
Part No. TCM1210G-301-2P TCM1210G TCM1210G-201-2P TCM1210G-650-2P TCM1210G-900-2P TCM1210G-900-2P-T200
Description Common Mode Filters(SMD) For High-speed Differential Signal Line
2 FUNCTIONS, 10 V, 0.05 A, DATA LINE FILTER

File Size 47.17K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-8518-21H
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Left Polarized, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    TCM8240MD

Toshiba Semiconductor
Part No. TCM8240MD
Description 1.3 Mega pixel sensor chip

File Size 282.10K  /  30 Page

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Amphenol Communications Solutions

Part No. 77313-185-14LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 14 Positions
Tech specs    

Official Product Page

For TCM-3185 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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