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  P25-0126 Datasheet PDF File

For P25-0126 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    MERSEN
Part No. A70P25-4
Description VERY FAST BLOW ELECTRIC FUSE, 25A, 700VAC, 650VDC, 100000A (IR), INLINE/HOLDER
File Size 176.75K  /  2 Page

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Amphenol Communications Solutions
Part No. 10075025-G01-26ULF
Description Minitek®, Wire to Board Connectors, Shrouded Header - Through Mount Pin-in-Paste - Double row - 26 Positions - 2mm (0.079inch) - Vertical
Tech specs 　 　

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HUA FENG CIRCUIT





    BSP250

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. BSP250
Description P-channel enhancement mode vertical D-MOS transistor
File Size 114.16K  /  12 Page

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Amphenol Communications Solutions
Part No. 10126619-003624ELF
Description HPCE R/A Receptacle 24S36P
Tech specs 　 　

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    SKP253

Sanken electric
Part No. SKP253
Description MOSFET
MOS FET
File Size 341.79K  /  9 Page

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Amphenol Communications Solutions
Part No. 10126492-102LF
Description Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Vertical, Press Fit, 4 Rows, 48 Positions.
Tech specs 　 　

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    TOSHIBA
Part No. TLP250
Description Photocoupler GaAlAs Ired & Photo .IC
File Size 212.85K  /  8 Page

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Amphenol Communications Solutions
Part No. 77313-801-26LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 26 Positions
Tech specs 　 　

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    Diodes
Part No. AP2501
Description (AP2501 / AP2511) 2.5A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH
File Size 442.07K  /  18 Page

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Amphenol Communications Solutions
Part No. 71600-126LF
Description Quickie® IDC receptacle, Wire to Board, 2.54mm(0.100in), Double Row, 26 positions
Tech specs 　 　

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    TLP251

Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TLP251
Description INVERTER FOR AIR CONDITIONOR INDUCTION HEATING
File Size 324.88K  /  8 Page

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Amphenol Communications Solutions
Part No. 10126366-12JLF
Description ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 4-Pair, 10 column, 140 position, Vertical Header, Left Guide Pin.
Tech specs 　 　

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    AP2509

Teledyne Technologies Incorporated
Part No. AP2509
Description 10 TO 2500 MHzTO-8 CASCADABLE AMPLIFIER
File Size 156.09K  /  2 Page

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Amphenol Communications Solutions
Part No. 101269331604103ALF
Description HPCE-STRADDLE MOUNT ASSEMBLY 20P10S
Tech specs 　 　

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    Diodes
Part No. AP2552
Description (AP2552x / AP2553x) PRECISION ADJUSTABLE CURRENT-LIMITED POWER SWITCHES
File Size 479.46K  /  16 Page

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Amphenol Communications Solutions
Part No. 101269333204242FLF
Description HPCE-STRADDLE MOUNT ASSEMBLY 36P24S
Tech specs 　 　

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    TLP250

Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TLP250
Description TRANSISTOR INVERTER FOR AIR CONDITIONOR IGBT GATE DRIVE POWER MOS FET GATE DRIVE
File Size 149.25K  /  8 Page

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Amphenol Communications Solutions
Part No. 92090-126LF
Description Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 26 Positions, 2.00mm (0.079in) Pitch..
Tech specs 　 　

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    TOSHIBA
Part No. TLP251
Description Photocoupler GaAlAs Ired & Photo IC
File Size 199.81K  /  8 Page

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Amphenol Communications Solutions
Part No. 77311-401-26LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

For P25-0126 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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