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  joint-h d Datasheet PDF File

For joint-h d Found Datasheets File :: 1272    Search Time::2.125ms    
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    D1121SH

eupec GmbH
Part No. d1121SH
OCR Text ...rgently recommend - to perform joint risk and quality assessments; - the conclusion of quality agreements; - to establish joint measures of an ongoing product survey, and that we may make delivery depended on the realization of any su...
Description Fast Hard drive diod e

File Size 170.04K  /  6 Page

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    LA187B-5-4G1H-PF

LIGITEK electronics co., ltd.
Part No. LA187B-5-4G1H-PF
OCR Text ... distance:2mm min(from solder joint to case) dip soldering preheat: 120 c max preheat time: 120seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder ...
Description LEd ARRAY

File Size 118.73K  /  7 Page

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    LG2041-TRF-X

LIGITEK electronics co., ltd.
Part No. LG2041-TRF-X
OCR Text ...y) distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile dip Soldering Preheat: 120C Max Preheat time: 60seconds Max Ramp-up 2 C/sec(max) Ramp-down:-5C/sec(max) Solder Bath:260C Max dipping Time:3 seconds Max distance:2mm ...
Description TAPE ANd REEL TYPE LEd LAMPS

File Size 137.10K  /  8 Page

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    MSD601-RT1G MSD601-RT1-D

ON Semiconductor
Part No. MSd601-RT1G MSd601-RT1-d
OCR Text ... 205 to 219 c peak at solder joint desired curve for low mass assemblies 100 c 150 c 160 c 140 c figure 1. typical solder heating pro...h d c b l a 1 3 2 j k dim a min max min max inches 2.70 3.10 0.1063 0.1220 millimeters b 1.30 1.70 0...
Description Small Signal Plastic NPN
NPN General Purpose Amplifier Transistors Surface Mount

File Size 44.06K  /  4 Page

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    BAW56WT1 ON0138

Motorola, Inc
ON Semi
Part No. BAW56WT1 ON0138
OCR Text ...ard at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMd310 convection...H dIM A B C d G H J K L N R S V CASE 419-02 ISSUE H SC-70/SOT-323 STYLE 4: PIN 1. CATHOdE 2...
Description dual Switching diode
From old datasheet system
CASE 419 -02 ,STYLE4 SC-70SOT-323

File Size 92.64K  /  6 Page

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    LVY3330-T-PF-TBS-X LVY3330/T-PF/TBS-X

LIGITEK electronics co., ltd.
LIGITEK electronics co....
Part No. LVY3330-T-PF-TBS-X LVY3330/T-PF/TBS-X
OCR Text ...x distance:2mm min(from solder joint to body) 5 /sec max note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 0 0 25 120 preheat 50 100 2 /sec ma...
Description TAPE ANd BOX TYPE LEd LAMPS
   TAPE ANd BOX TYPE LEd LAMPS

File Size 119.63K  /  7 Page

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    LDBK3333-TRF-X

LIGITEK electronics co., ltd.
Part No. LdBK3333-TRF-X
OCR Text ...y) distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2C/sec(max) Ramp-down:-5 C/sec(max) Solder Bath:260C Max dipping Time:3 seconds Max distance:2mm...
Description TAPE ANd REEL TYPE LEd LAMPS

File Size 138.48K  /  8 Page

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    2SA1774 ON0108

Motorola Inc
Motorola, Inc
ON Semiconductor
Part No. 2SA1774 ON0108
OCR Text ...ard at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMd310 convection...H J K L S MILLIMETERS MIN MAX 0.70 0.80 1.40 1.80 0.60 0.90 0.15 0.30 1.00 BSC --- 0.10 0.10 0.25 1....
Description PNP GENERAL PURPOSE AMPLIFIER TRANSISTORS SURFACE MOUNT
From old datasheet system

File Size 94.83K  /  6 Page

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For joint-h d Found Datasheets File :: 1272    Search Time::2.125ms    
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