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  GSP1.8501.1 Datasheet PDF File

For GSP1.8501.1 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    TVS8501V12

ON Semiconductor
Part No. TVS8501V12
Description    Transient Voltage Suppressors

File Size 52.58K  /  4 Page

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Amphenol Communications Solutions

Part No. 95278-501-42LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 42 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0850133213 85013-3213

Molex Electronics Ltd.
Part No. 0850133213 85013-3213
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1渭m (40渭) Selective Gold (Au), 96 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1μm (40μ) Selective Gold (Au), 96 Circuits, Lead free

File Size 128.74K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-501-46LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 46 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    85015-9006 0850159006

Molex Electronics Ltd.
Part No. 85015-9006 0850159006
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Press-fit Style R , 0.6渭m (24渭) Selective Gold (Au), 128 Circuits, Lead Free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Press-fit Style R , 0.6μm (24μ) Selective Gold (Au), 128 Circuits, Lead Free

File Size 75.18K  /  3 Page

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Amphenol Communications Solutions

Part No. 95278-501A16LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 16 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0850130050 85013-0050

Molex Electronics Ltd.
Part No. 0850130050 85013-0050
Description 2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse

File Size 266.38K  /  8 Page

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Amphenol Communications Solutions

Part No. 95278-501A40LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 40 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    76763-8501 0767638501

Molex Electronics Ltd.
Part No. 76763-8501 0767638501
Description 2.00mm (.079) Pitch VHDM庐 H Board-to-Board Backplane Header, Vertical, 6-Row, Open End Module, Open Ends Version, 60 Circuits, Pin Length 4.75mm (.187)
2.00mm (.079) Pitch VHDM? H Board-to-Board Backplane Header, Vertical, 6-Row, Open End Module, Open Ends Version, 60 Circuits, Pin Length 4.75mm (.187)

File Size 372.47K  /  4 Page

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Amphenol Communications Solutions

Part No. 95278-501B20LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 20 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0850132828 85013-2828

Molex Electronics Ltd.
Part No. 0850132828 85013-2828
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, 3-Row C-Pin, Press-Fit Style R Male

File Size 215.91K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-501B40LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 40 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0850131225

Molex Electronics Ltd.
Part No. 0850131225
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, C-Pin Press-Fit Style R Reverse, 1μm (40μ) Selective Gold (Au), 96 Circuits, Lead free

File Size 80.61K  /  3 Page

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Amphenol Communications Solutions

Part No. RJCSE508501
Description Modular Jack - Right Angle, Input Output Connectors 8P8C, Without Shield, With LEDs.
Tech specs    

Official Product Page

    0850130103

Molex Electronics Ltd.
Part No. 0850130103
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, C-Pin Press-Fit Style R Reverse, 0.6μm (24μ) Selective Gold (Au), 64 Circuits, Lead free

File Size 81.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 468-5010-061
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 6 Row HSD, 10 positions, open, 4.75mm (0.187in), Header.
Tech specs    

Official Product Page

    0850130385 85013-0385

Molex Electronics Ltd.
Part No. 0850130385 85013-0385
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, C-Pin Press-Fit Style R/2 Reverse

File Size 311.07K  /  6 Page

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Amphenol Communications Solutions

Part No. 498-5010-A62
Description VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 6 Row VHDM, 10 positions, right, A-Key, 6.25mm (0.246in), Header.
Tech specs    

Official Product Page

    0850131768 85013-1768

Molex Electronics Ltd.
Part No. 0850131768 85013-1768
Description 2.54mm (.100) Pitch DIN 41612 Header, Style R/2 Reverse, 1μm (40μ) Selective Gold (Au) ,48 Circuits

File Size 112.87K  /  5 Page

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Amphenol Communications Solutions

Part No. 498-5010-C64
Description VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 6 Row VHDM, 10 positions, right, C-Key, 5.15mm (0.202in), Header.
Tech specs    

Official Product Page

For GSP1.8501.1 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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