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  DFN6-3611 Datasheet PDF File

For DFN6-3611 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    IDT
Part No. IDT72T36105 IDT72T36115
Description 2.5 VOLT HIGH-SPEED TeraSync? FIFO 36-BIT CONFIGURATIONS
File Size 530.30K  /  57 Page

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Amphenol Communications Solutions
Part No. 89036-112LF
Description Metral® Board Connectors, Backplane Connectors, 4 Row Signal Receptacle, Right Angle, Solder-to-Board.
Tech specs 　 　

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HUA FENG CIRCUIT





    Samsung Electronic
Part No. K7P801811M K7P803611M
Description 256Kx36 & 512Kx18 Synchronous Pipelined SRAM Data Sheet
File Size 312.70K  /  13 Page

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Amphenol Communications Solutions
Part No. 53611-G40-8LF
Description Quickie Header, Wire to Board Connector, Double Row, 40 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs 　 　

Official Product Page

    APS3611 APS3611RS26Q1

ANADIGICS, Inc
Part No. APS3611 APS3611RS26Q1
Description 870 GHz Two-way Active Power Splitter Optimized for MOCA-Enabled Subscriber equipment
File Size 317.65K  /  10 Page

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Amphenol Communications Solutions
Part No. 54121-107361150LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    Integrated Device Technology, Inc.
Part No. 723611L15PQFG
Description 64 X 36 OTHER FIFO, 10 ns, PQFP132 GREEN, PLASTIC, QFP-132
File Size 167.75K  /  20 Page

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Amphenol Communications Solutions
Part No. 53611-G34-4LF
Description Quickie Header, Wire to Board Connector, Double Row, 34 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs 　 　

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Part No. K7P403611A-H30 K7P401811A-H30
Description 128K X 36 STANDARD SRAM, 1.8 ns, PBGA119 14 X 22 MM, BGA-119
File Size 296.05K  /  13 Page

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Amphenol Communications Solutions
Part No. 53611-G10-8LF
Description Quickie Header, Wire to Board Connector, Double Row, 10 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs 　 　

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Part No. CXK77B3611AGB_5
Description From old datasheet system
File Size 78.05K  /  4 Page

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Amphenol Communications Solutions
Part No. 53611-G26-6LF
Description Quickie Header, Wire to Board Connector, Double Row, 26 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs 　 　

Official Product Page

    MGFC36V3436 MGFC36V343611

Mitsubishi Electric Semiconductor
Part No. MGFC36V3436 MGFC36V343611
Description C band internally matched power GaAs FET
File Size 86.77K  /  2 Page

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Amphenol Communications Solutions
Part No. 91036-110LF
Description Rib-Cage® Board To Board Connector, Surface Mount Vertical Shrouded PCB Header, 20 Positions, Holddown Mounting style.
Tech specs 　 　

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Part No. IBM043611ULAA-6 IBM043611ULAA-5
Description x36 Fast Synchronous SRAM
File Size 910.63K  /  18 Page

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Amphenol Communications Solutions
Part No. 89361-114LF
Description Minitek® IDC 2.00mm Pitch, Wire To Board Connector, Receptacle.
Tech specs 　 　

Official Product Page

    MGFC39V3436 MGFC39V343611

Mitsubishi Electric Semiconductor
Part No. MGFC39V3436 MGFC39V343611
Description C band internally matched power GaAs FET
File Size 86.74K  /  2 Page

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Amphenol Communications Solutions
Part No. 89361-120LF
Description Minitek® IDC 2.00mm Pitch, Wire To Board Connector, Receptacle.
Tech specs 　 　

Official Product Page

    CXK77B3611AGB- CXK77B3611AGB-5 CXK77B3611AGB-6

SONY[Sony Corporation]
Part No. CXK77B3611AGB- CXK77B3611AGB-5 CXK77B3611AGB-6
Description High Speed Bi-CMOS Synchronous Static RAM
File Size 80.21K  /  4 Page

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Amphenol Communications Solutions
Part No. 89361-148LF
Description Minitek® IDC 2.00mm Pitch, Wire To Board Connector, Receptacle.
Tech specs 　 　

Official Product Page

For DFN6-3611 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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