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  A6E-8101 Datasheet PDF File

For A6E-8101 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    73810-1203 0738101203

Molex Electronics Ltd.
Part No. 73810-1203 0738101203
Description 2.00mm (.079) Pitch HDM? Board-to-Board Midplane Header, Vertical SMC, Press-Fit, Double End Option, Slide On Housing, 144 Circuits
2.00mm (.079") Pitch HDM庐 Board-to-Board Midplane Header, Vertical SMC, Press-Fit, Double End Option, Slide On Housing, 144 Circuits

File Size 156.83K  /  4 Page

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Amphenol Communications Solutions

Part No. 75168-101-10LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    73810-1202 0738101202

Molex Electronics Ltd.
Part No. 73810-1202 0738101202
Description 2.00mm (.079) Pitch HDM? Board-to-Board Midplane Header, Vertical SMC, PressFit, Double End Option, Slide On Housing, 144 Circuits
2.00mm (.079") Pitch HDM庐 Board-to-Board Midplane Header, Vertical SMC, PressFit, Double End Option, Slide On Housing, 144 Circuits

File Size 164.69K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114828-10102LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions
Tech specs    

Official Product Page

    73810-1201 0738101201

Molex Electronics Ltd.
Part No. 73810-1201 0738101201
Description 2.00mm (.079) Pitch HDM? Board-to-Board Midplane Header, Vertical SMC, PressFit, Double End Option, Slide On Housing, 144 Circuits
2.00mm (.079") Pitch HDM庐 Board-to-Board Midplane Header, Vertical SMC, PressFit, Double End Option, Slide On Housing, 144 Circuits

File Size 164.68K  /  4 Page

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Amphenol Communications Solutions

Part No. 95278-101B24LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 24 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    73810-1100 0738101100

Molex Electronics Ltd.
Part No. 73810-1100 0738101100
Description 2.00mm (.079) Pitch HDM Board-to-Board Midplane Header, Vertical SMC, Press- Fit, Double End Option
2.00mm (.079") Pitch HDM Board-to-Board Midplane Header, Vertical SMC, Press- Fit, Double End Option

File Size 164.63K  /  4 Page

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Amphenol Communications Solutions

Part No. 95278-101B22LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 22 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0643181018

Molex Electronics Ltd.
Part No. 0643181018
Description .635mm (.025), 1.50mm (.059), 2.80mm (.110), Power CMC Connector, 28 CircuitsLeft Wire Output, Gray Coding, Mat Sealed
MOLEX Connector

File Size 654.49K  /  6 Page

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Amphenol Communications Solutions

Part No. 10131318-1012100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Black Color, 10 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    73810-1000 0738101000

Molex Electronics Ltd.
Part No. 73810-1000 0738101000
Description 2.00mm (.079) Pitch HDM? Board-to-Board Midplane Header, Vertical SMC, Press-Fit, Double End Option, Slide On Housing, 144 Circuits
2.00mm (.079") Pitch HDM庐 Board-to-Board Midplane Header, Vertical SMC, Press-Fit, Double End Option, Slide On Housing, 144 Circuits

File Size 164.59K  /  4 Page

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Amphenol Communications Solutions

Part No. 10131318-10111G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 10 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    43743-8101 0437438101

Molex Electronics Ltd.
Part No. 43743-8101 0437438101
Description Modular Jack, Right Angle, Low Profile, SMT, 8/8

File Size 217.82K  /  4 Page

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Amphenol Communications Solutions

Part No. 95278-101-36LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    Toshiba
Part No. TPCS8101 EA09200
Description From old datasheet system

File Size 286.33K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-101-42LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 42 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    31068-1012 0310681012

Molex Electronics Ltd.
Part No. 31068-1012 0310681012
Description 2.54mm (.100) H-DAC 64? 4 Way Receptacle Assembly, Single-Row, Polarization C
2.54mm (.100") H-DAC 64垄芒, 4 Way Receptacle Assembly, Single-Row, Polarization C

File Size 413.61K  /  5 Page

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Amphenol Communications Solutions

Part No. 75168-101-13LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 13 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    31068-1011 0310681011

Molex Electronics Ltd.
Part No. 31068-1011 0310681011
Description 2.54mm (.100) H-DAC 64? 4 Way Receptacle Assembly, Single-Row, Polarization B
2.54mm (.100") H-DAC 64垄芒, 4 Way Receptacle Assembly, Single-Row, Polarization B

File Size 413.60K  /  5 Page

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Amphenol Communications Solutions

Part No. 75168-101-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For A6E-8101 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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