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  90130-3318 Datasheet PDF File

For 90130-3318 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    0039013085 0039013085-18

Molex Electronics Ltd.
Part No. 0039013085 0039013085-18
Description Mini-Fit Jr. Receptacle Housing, Dual Row, 8 Circuits, UL 94V-2, Black
File Size 22.95K  /  1 Page

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Amphenol Communications Solutions
Part No. 68690-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0039013083 0039013083-18

Molex Electronics Ltd.
Part No. 0039013083 0039013083-18
Description Mini-Fit Jr. Plug Housing, Dual Row, 8 Circuits, UL 94V-2, without Panel Mounting Ears
File Size 37.87K  /  2 Page

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Amphenol Communications Solutions
Part No. 92090-130LF
Description Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
Tech specs 　 　

Official Product Page

    0901303126-17

Molex Electronics Ltd.
Part No. 0901303126-17
Description C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 26 Circuits, Black
File Size 24.75K  /  2 Page

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Amphenol Communications Solutions
Part No. 10065490-130TRLF
Description Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
Tech specs 　 　

Official Product Page

    0901301234-17

Molex Electronics Ltd.
Part No. 0901301234-17
Description    C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 34 Circuits, Black
File Size 24.75K  /  2 Page

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Amphenol Communications Solutions
Part No. 78290-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs 　 　

Official Product Page

    0901303116

Molex Electronics Ltd.
Part No. 0901303116
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 16 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
File Size 168.44K  /  4 Page

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Amphenol Communications Solutions
Part No. L17H2990130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs 　 　

Official Product Page

    0901303118

Molex Electronics Ltd.
Part No. 0901303118
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 18 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
File Size 168.45K  /  4 Page

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Amphenol Communications Solutions
Part No. 69190-130HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0901303114

Molex Electronics Ltd.
Part No. 0901303114
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 14 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
File Size 168.44K  /  4 Page

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Amphenol Communications Solutions
Part No. 55533-318
Description Minitek® 2.00mm, Board to Board Connector, Low Profile, PCB Mounted Receptacle , Vertical , Surface Mount, Top Entry, Double row, 18 Positions, 2.00mm (0.079in) Pitch.
Tech specs 　 　

Official Product Page

    0901303112

Molex Electronics Ltd.
Part No. 0901303112
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 12 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
File Size 168.44K  /  4 Page

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Amphenol Communications Solutions
Part No. 63453-318LF
Description <span style=\\background-color: #FFFF00\\><b>PREFERRED P/N SERIES FOR NEW PROJECT: 10131936</b></span><br><br>Minitek® 2.00mm, Board to Board Connector, Minitek II VCC (HTP), PCB Mounted Receptacle , Vertical , Through Hole, Top Entry, Double row, 18 Positions, 2.00mm (0.079in) Pitch.
Tech specs 　 　

Official Product Page

    0901303110

Molex Electronics Ltd.
Part No. 0901303110
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 10 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
File Size 168.44K  /  4 Page

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Amphenol Communications Solutions
Part No. 131-3318-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Left End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    90130-1150 0901301150

Molex Electronics Ltd.
Part No. 90130-1150 0901301150
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 50 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
File Size 585.88K  /  7 Page

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Amphenol Communications Solutions
Part No. 76383-318LF
Description Dubox®2.54mm, Board to Board Connector, Shrouded Header, Double Row, Right Angle.
Tech specs 　 　

Official Product Page

For 90130-3318 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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