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  87758-3017 Datasheet PDF File

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    0877580417 87758-0417

Molex Electronics Ltd.
Part No. 0877580417 87758-0417
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Texas Instruments

Part No. 5962-87758012A
Description Octal Bus Transceivers With 3-State Outputs 20-LCCC -55 to 125
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0877581250 87758-1250

Molex Electronics Ltd.
Part No. 0877581250 87758-1250
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 12 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 12 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.77K  /  4 Page

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Texas Instruments

Part No. 5962-8775801RA
Description Octal Bus Transceivers With 3-State Outputs 20-CDIP -55 to 125
Tech specs    

Official Product Page

    0877582250 87758-2250

Molex Electronics Ltd.
Part No. 0877582250 87758-2250
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.77K  /  4 Page

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Texas Instruments

Part No. 5962-8775801VSA
Description Octal Bus Transceivers With 3-State Outputs 20-CFP -55 to 125
Tech specs    

Official Product Page

    0877580416 87758-0416

Molex Electronics Ltd.
Part No. 0877580416 87758-0416
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Texas Instruments

Part No. 5962-8775801SA
Description Octal Bus Transceivers With 3-State Outputs 20-CFP -55 to 125
Tech specs    

Official Product Page

    87758-3817 0877583817

Molex Electronics Ltd.
Part No. 87758-3817 0877583817
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 38 Circuits, 0.76μm(30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 38 Circuits, 0.76μm(30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.41K  /  4 Page

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Amphenol Communications Solutions

Part No. 66953-017
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Mount, Top Entry, Double Row, 34 Position ,2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    87758-4050 0877584050

Molex Electronics Ltd.
Part No. 87758-4050 0877584050
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 40 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 40 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 51730-175LF
Description PwrBlade®, Power Supply Connectors, 4P 16S 2P Right Angle Header.
Tech specs    

Official Product Page

    NTE[NTE Electronics]
Part No. NTE3027 NTE3017
Description Infrared Emitting Diode High Speed for Remote Control

File Size 19.53K  /  2 Page

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Amphenol Communications Solutions

Part No. 54201-T3017LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 17 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TN3017 TM3017 BX3017

Spectrum Microwave, Inc.
API Technologies Corp
Part No. TN3017 TM3017 BX3017
Description RF AMPLIFIER MODEL

File Size 35.25K  /  1 Page

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Amphenol Communications Solutions

Part No. 59202-H30-17A082LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 34 Positions.
Tech specs    

Official Product Page

    Microchip
Part No. MCP23017-E/SSVAO
Description Interface- Serial Peripherals

File Size 1,187.12K  /  42 Page

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Amphenol Communications Solutions

Part No. 59362-T3017A067LF
Description Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 34 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    SCT3017AL

Rohm
Part No. SCT3017AL
Description    N-channel SiC power MOSFET

File Size 734.28K  /  14 Page

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Amphenol Communications Solutions

Part No. 54202-S3017LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 34 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 87758-3017 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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