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Amphenol Communications Solutions |
| Part No. |
76341-417LF
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| Description |
Dubox® 2.54mm, Board to Board Connector, PCB mounted Receptacle, Vertical, Through Hole, Top Entry, Single row , 17 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68771-417HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch, Vertical, 6.86 mm (0.27 in.) Mating, 2.54 mm (0.1 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54121-108141700LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 14 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77314-178LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
94611-417HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 17 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87758-4050 0877584050
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 40 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 40 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
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| File Size |
135.77K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10141731-005RLF
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| Description |
DDR4 SODIMM 260pin SMT, 5.2H, reverse version., Right Angle
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87758-3216 0877583216
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 32 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 32 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.71K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68461-417HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch, Right Angle, 10.16 mm (0.4 in.) Mating, 8.13 mm (0.32 in.) Tail
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87758-3817 0877583817
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 38 Circuits, 0.76μm(30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 38 Circuits, 0.76μm(30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.41K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77314-178TLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10141744-001LF
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| Description |
HPCE VT Receptacle 2LP20S
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877581250 87758-1250
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 12 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 12 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
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| File Size |
135.77K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10141730-001RLF
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| Description |
DDR4 SODIMM 260pin SMT, 5.2H, Standard version, Right Angle
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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