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Molex Electronics Ltd.
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| Part No. |
75757-6261 0757576261
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| Description |
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, 1.25μm(50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 1.25μm(50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on
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| File Size |
166.28K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10127819-14221LF
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| Description |
Minitek® Pwr 4.2, Dual Row, Right Angle Through Hole Header, 100u\\ Bright Tin plating, Black Color, 14 Positions, Non GW Compatible Nylon66, Tray Packing.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10131319-14221G0LF
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| Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 14 Positions, GW Compatible Nylon66, Tray Packing.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-6231 0757576231
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| Description |
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
166.28K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68021-422HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 22 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
76314-226LF
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| Description |
Dubox® 2.54mm, Board to Board Connector, 52 Positions,Double Row,Vertical,2.54mm pitch,Card Connector.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
89891-422HLF
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| Description |
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 44 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0261 0757570261
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
99.22K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
61082-081422LF
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| Description |
BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 80 Positions.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61082-061422LF
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| Description |
BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 60 Positions.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0231 0757570231
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail,
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail,
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| File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77311-422-09LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 09 Positions, 2.54 mm Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0242 0757570242
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77311-422-19LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0252 0757570252
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77311-422-29LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch.
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Official Product Page
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