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  75705-5604 Datasheet PDF File

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    5503 55031533200 55035604403

Sumida Corporation
Part No. 5503 55031533200 55035604403
Description 1 ELEMENT, 0.056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Wire Wound Chip Inductors
1 ELEMENT, 15 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD

File Size 397.61K  /  4 Page

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Amphenol Communications Solutions

Part No. 91625-604LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Top Entry, Double Row, Selectively Loaded, 40 Position ,2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    IR25604SPBF IR25604STRPBF

International Rectifier
Part No. IR25604SPBF IR25604STRPBF
Description High and Low Side Driver

File Size 1,047.64K  /  20 Page

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Amphenol Communications Solutions

Part No. 10073456-048LF
Description Quickie Header, Wire to Board Connector, Double Row, 34 Positions, Press-Fit Slimline Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs    

Official Product Page

   
Part No. 5962F9560401VPA
Description Amplifier. Other

File Size 54.61K  /  14 Page

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Amphenol Communications Solutions

Part No. 10073456-047LF
Description Quickie Header, Wire to Board Connector, Double Row, 34 Positions, Press-Fit Slimline Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs    

Official Product Page

    EC28A1560401 EC28A1520401

ALPS ELECTRIC CO.,LTD.
Part No. EC28A1560401 EC28A1520401
Description 28mm Size Encoder Type

File Size 130.55K  /  2 Page

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Amphenol Communications Solutions

Part No. 10073456-044LF
Description Quickie Header, Wire to Board Connector, Double Row, 34 Positions, Press-Fit Slimline Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs    

Official Product Page

    K4H560438H K4H560438H-UC_LA2 K4H560438H-UC_LB0 K4H561638H-UC_LA2 K4H561638H-UC_LB0 K4H561638H-UC_LB3 K4H561638H-UC_LCC K

SAMSUNG[Samsung semiconductor]
Part No. K4H560438H K4H560438H-UC_LA2 K4H560438H-UC_LB0 K4H561638H-UC_LA2 K4H561638H-UC_LB0 K4H561638H-UC_LB3 K4H561638H-UC_LCC K4H561638H K4H560838H-UC_LCC K4H560838H K4H560838H-UC_LA2 K4H560838H-UC_LB0 K4H560838H-UC_LB3
Description 256Mb H-die DDR SDRAM Specification

File Size 356.30K  /  24 Page

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Amphenol Communications Solutions

Part No. 51740-10405604CCLF
Description PwrBlade®, Power Supply Connectors, 4P 56S 4P Vertical Receptacle.
Tech specs    

Official Product Page

    K4S560432E-NC75 K4S560832E-NC75 K4S560832E-NL75 K4S561632E K4S560432E-NC K4S560432E-NL75

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S560432E-NC75 K4S560832E-NC75 K4S560832E-NL75 K4S561632E K4S560432E-NC K4S560432E-NL75
Description 256Mb E-die SDRAM Specification 54pin sTSOP-II 256Mb的电子芯片内存规4pin sTSOP -

File Size 180.64K  /  13 Page

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Amphenol Communications Solutions

Part No. 10136656-0421LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Gold Flash plating, 4 Positions, Black Color, GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    SCL5238E SCL5233E SCL5463E SCL5474E SCL5458 SCL5458E SCL5604E SCL5604 SCL5233 SCL5238

Allegro MicroSystems, Inc.
ALLEGRO[Allegro MicroSystems]
Part No. SCL5238E SCL5233E SCL5463E SCL5474E SCL5458 SCL5458E SCL5604E SCL5604 SCL5233 SCL5238
Description (SCLxxxx) 2 Function 4 Digital VF Automotive Clocks
From old datasheet system
2-FUCTION, 4-DIGIT VF AUTOMOTIVE CLOCKS

File Size 713.50K  /  6 Page

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Amphenol Communications Solutions

Part No. 75160-156-04LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,4 position, 2.54mm pitch
Tech specs    

Official Product Page

    K4H560438J-LC/LB0 K4H560438J-LC/LB3 K4H560838J-LC/LCC K4H561638J-LC/LB3 K4H561638J-LC/LCC K4H560838J-LC/LB3

Samsung semiconductor
Part No. K4H560438J-LC/LB0 K4H560438J-LC/LB3 K4H560838J-LC/LCC K4H561638J-LC/LB3 K4H561638J-LC/LCC K4H560838J-LC/LB3
Description 256Mb J-die DDR SDRAM Specification

File Size 352.76K  /  24 Page

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Amphenol Communications Solutions

Part No. 51700-10405604CCLF
Description PwrBlade®, Power Connectors, 4P 56S 4P Vertical Header, Press Fit
Tech specs    

Official Product Page

    K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60 K4S561632E-TL75 K4S560432E-TL

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60 K4S561632E-TL75 K4S560432E-TL75 K4S560432E-TC75 K4S560432E-TC
Description 256Mb E-die SDRAM Specification 54pin sTSOP-II

File Size 196.59K  /  14 Page

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Amphenol Communications Solutions

Part No. 75844-156-04LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    K4S560432E-TC K4S560432E-TC75 K4S561632E-TL75 K4S560432E-TL75 K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Part No. K4S560432E-TC K4S560432E-TC75 K4S561632E-TL75 K4S560432E-TL75 K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60
Description 256Mb E-die SDRAM Specification 256Mb的电子芯片内存规

File Size 194.54K  /  14 Page

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Amphenol Communications Solutions

Part No. 51720-10405604ABLF
Description PwrBlade®, Power Supply Connectors, 4P 56S 4P Right Angle Header.
Tech specs    

Official Product Page

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