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  71308-5472 Datasheet PDF File

For 71308-5472 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    0713085462

Molex Electronics Ltd.
Part No. 0713085462
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 62 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 68405-472
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0713086478

Molex Electronics Ltd.
Part No. 0713086478
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 78 Circuits, 1.50μm (59u) Minimum
2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 78 Circuits, 1.50楼矛m (59u") Minimum

File Size 1,475.71K  /  8 Page

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Amphenol Communications Solutions

Part No. RJE1R288325472
Description Modular Jacks, Input Output Connectors, 8P8C, Cat6 over Cat5e, Stacked, Shield, With LEDs
Tech specs    

Official Product Page

    0713086476

Molex Electronics Ltd.
Part No. 0713086476
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 76 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 76 Circuits1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30m

File Size 1,475.71K  /  8 Page

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Amphenol Communications Solutions

Part No. RJE1R288335472
Description Modular Jacks, Input Output Connectors, 8P8C, Cat6, Stacked, Shield, With LEDs
Tech specs    

Official Product Page

    713084020N

Molex Electronics Ltd.
Part No. 713084020N
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 20 Circuits, Tin (Sn) Plating, with 3.30mm PCB Locator Pegs

File Size 26.96K  /  2 Page

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Amphenol Communications Solutions

Part No. 68695-472HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Double Row, 72 Positions, 2.54mm Pitch, Right Angle, 5.84mm (0.23in) Mating, 2.29mm (0.09in) Tail.
Tech specs    

Official Product Page

    0713086474

Molex Electronics Ltd.
Part No. 0713086474
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 74 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 74 Circuits1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30m

File Size 1,475.71K  /  8 Page

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Amphenol Communications Solutions

Part No. 51915-472LF
Description PwrBlade®, Power Connectors, 2ACP 8S Right Angle Receptacle, Solder To Board
Tech specs    

Official Product Page

    0713086472

Molex Electronics Ltd.
Part No. 0713086472
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 72 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 72 Circuits,1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30

File Size 1,475.71K  /  8 Page

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Amphenol Communications Solutions

Part No. 79425-472HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 72 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    0713085422

Molex Electronics Ltd.
Part No. 0713085422
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 22 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 95547-250CALF
Description Assembly, Top Mount, S/D(68Pins), VTB, Type 123, 5V, 5mm s/o, Right Push Rod Eject, 8mm Card Travel
Tech specs    

Official Product Page

    0713086470

Molex Electronics Ltd.
Part No. 0713086470
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 70 Circuits 1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 70 Circuits 1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30

File Size 1,475.71K  /  8 Page

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Amphenol Communications Solutions

Part No. RJE1R288235472
Description Modular Jacks, Input Output Connectors, 8P8C, Cat5e over Cat6, Stacked, Shield, With LEDs
Tech specs    

Official Product Page

    713084016N

Molex Electronics Ltd.
Part No. 713084016N
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 16 Circuits, Tin (Sn) Plating, with 3.30mm PCB Locator Pegs

File Size 27.03K  /  2 Page

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Amphenol Communications Solutions

Part No. 380-5472-20W
Description Receptacle,INFINX,6Pair 18 Positionition 24mm,85Ω, w/lossy
Tech specs    

Official Product Page

    0713085404 71308-5404

Molex Electronics Ltd.
Part No. 0713085404 71308-5404
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 4 Circuits,1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 4 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator Pegs

File Size 1,475.56K  /  8 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 68405-472HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

For 71308-5472 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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