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  534-12202 Datasheet PDF File

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    BD533 BD534

STMicroelectronics
Part No. BD533 BD534
Description Complementary power transistors
File Size 329.37K  /  11 Page

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Amphenol Communications Solutions
Part No. 84512-202LF
Description 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    75341-7477

Molex Electronics Ltd.
Part No. 75341-7477
Description 1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX? Backplane Connector System, Power Module, 12 Circuits, 1.27μm (50μ) Gold (Au)
File Size 303.46K  /  6 Page

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Amphenol Communications Solutions
Part No. 84512-202
Description 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array
Tech specs 　 　

Official Product Page

    75341-7476

Molex Electronics Ltd.
Part No. 75341-7476
Description 1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX? Backplane Connector System,Power Module, 12 Circuits, 1.27μm (50μ) Gold (Au
File Size 303.46K  /  6 Page

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Amphenol Communications Solutions
Part No. 54122-412202500LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    75341-7474

Molex Electronics Ltd.
Part No. 75341-7474
Description 1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX? Backplane Connector System, Power Module, 12 Circuits, 1.27μm (50μ) Gold (Au)
File Size 303.46K  /  6 Page

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Amphenol Communications Solutions
Part No. 10018783-12202TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x8, 98 Positions, 1.00mm (0.039in) Pitch
Tech specs 　 　

Official Product Page

    CUI INC
Part No. SJ1-2535-SMT-TR SJ1-2533-SMT SJ1-2533-SMT-TR SJ1-2534-SMT SJ1-2534-SMT-TR
Description 2.5 MM AUDIO JACKS
File Size 182.13K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-812202300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    75341-7767

Molex Electronics Ltd.
Part No. 75341-7767
Description 1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX? Backplane Connector System, Power Module, 12 Circuits, 1.27μm (50μ) Gold (Au)
File Size 303.46K  /  6 Page

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Amphenol Communications Solutions
Part No. 54122-812202450LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    75341-7746

Molex Electronics Ltd.
Part No. 75341-7746
Description 1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX庐 Backplane Connector System, Power Module, 12 Circuits, 1.27渭m (50渭) Gold (Au)
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX? Backplane Connector System, Power Module, 12 Circuits, 1.27μm (50μ) Gold (Au)
File Size 303.46K  /  6 Page

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Amphenol Communications Solutions
Part No. 10127112-202LF
Description Millipacs®, Millipacs High speed RA Receptacle type A Shielded with interconnection of ground positions
Tech specs 　 　

Official Product Page

    75341-4764

Molex Electronics Ltd.
Part No. 75341-4764
Description 1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX? Backplane Connector System, Power Module, 12 Circuits, 1.27μm (50μ) Gold (Au)
1.85mm by 1.85mm (.073 by .073") Pitch 4-Pair GbX庐 Backplane Connector System, Power Module, 12 Circuits, 1.27渭m (50渭") Gold (Au)
File Size 303.65K  /  6 Page

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Amphenol Communications Solutions
Part No. RJE0112202
Description Modular Jack - 6P2C, Right Angle, Two Port, Shield With Top and Side EMI Tabs
Tech specs 　 　

Official Product Page

    75341-4766

Molex Electronics Ltd.
Part No. 75341-4766
Description 1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX庐 Backplane Connector System, Power Module, 12 Circuits, 1.27渭m (50渭) Gold (Au)
File Size 303.65K  /  6 Page

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Amphenol Communications Solutions
Part No. 54242-812202600LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    75341-4767

Molex Electronics Ltd.
Part No. 75341-4767
Description 1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX? Backplane Connector System, Power Module, 12 Circuits, 1.27μm (50μ) Gold (Au)
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX庐 Backplane Connector System, Power Module, 12 Circuits, 1.27渭m (50渭) Gold (Au)
File Size 303.65K  /  6 Page

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Amphenol Communications Solutions
Part No. 54122-112202500LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

For 534-12202 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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