| |
|
 |
Amphenol Communications Solutions |
| Part No. |
10007607-802-06LF
|
| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled header ,Through Hole, Row Polarized ,Double row , 6 Positions ,2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |

Molex Electronics Ltd.
|
| Part No. |
0780350001 78035-0001
|
| Description |
0.60mm (.024") Pitch miniDIMM DDR2 Socket, Surface Mount, 22.5掳 Reverse Angle,0.76渭m (30渭") Gold (Au) Plating, Off-White Latches, with Pick-and-Place Cap, 244 0.60mm (.024) Pitch miniDIMM DDR2 Socket, Surface Mount, 22.5° Reverse Angle,0.76μm (30μ) Gold (Au) Plating, Off-White Latches, with Pick-and-Place Cap, 244
|
| File Size |
477.35K /
7 Page |
View
it Online |
Download Datasheet
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
10007607-801-36LF
|
| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled header ,Through Hole, Row Polarized ,Double row , 36 Positions ,2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |

Molex Electronics Ltd.
|
| Part No. |
0780790052 78079-0052
|
| Description |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing, Off-White Latches, 0.38渭m (15渭) Gold(Au) Plating 1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing, Off-White Latches, 0.38μm (15μ) Gold(Au) Plating
|
| File Size |
809.49K /
10 Page |
View
it Online |
Download Datasheet
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
10007607-802-36LF
|
| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled header ,Through Hole, Row Polarized ,Double row , 36 Positions ,2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |

Molex Electronics Ltd.
|
| Part No. |
0780790101 78079-0101
|
| Description |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Off-White Housing and Latches, 0.38渭m (15渭) Gold (Au) Plating 1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Off-White Housing and Latches, 0.38μm (15μ) Gold (Au) Plating
|
| File Size |
1,591.81K /
18 Page |
View
it Online |
Download Datasheet
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
10007607-801-06LF
|
| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled header ,Through Hole, Row Polarized ,Double row , 6 Positions ,2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
HS30780081
|
| Description |
Backplane connectors,cable backplane ,Paladin 4X8 Cable, 30 AWG, 25 GHz
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |

Molex Electronics Ltd.
|
| Part No. |
78016-1001 0780161001
|
| Description |
1.00mm (.039) Pitch iCool?/a> Low Profile VRM, Vertical, Surface Mount, with Towerwith Beveled Metal Pins, 0.76μm (30μ) Gold (Au) Plating, Signal 20, Power 72, 1.00mm (.039) Pitch iCool Low Profile VRM, Vertical, Surface Mount, with Towerwith Beveled Metal Pins, 0.76μm (30μ) Gold (Au) Plating, Signal 20, Power 72,
|
| File Size |
266.73K /
5 Page |
View
it Online |
Download Datasheet
|
| |
|
 |

Molex Electronics Ltd.
|
| Part No. |
78016-2001 0780162001
|
| Description |
1.00mm (.039) Pitch iCool Low Profile VRM, Vertical, Surface Mount, with Tower,with Beveled Metal Pins, 0.76μm (30μ) Gold (Au) Plating, Signal 22, Power 88 1.00mm (.039) Pitch iCool?/a> Low Profile VRM, Vertical, Surface Mount, with Tower,with Beveled Metal Pins, 0.76μm (30μ) Gold (Au) Plating, Signal 22, Power 88
|
| File Size |
332.29K /
7 Page |
View
it Online |
Download Datasheet
|
|

Bom2Buy.com

Price and Availability
|