4761-1809 pdf Datasheet P13 Part Num --- IC-ON-LINE


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4761-1809 Datasheet PDF File

For 4761-1809 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |

					Diodes
Part No.	ZM4763A ZM4761A ZM4762A ZM4764A ZM4760A ZM4733A
Description	Zener Diodes
File Size	55.06K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54121-809282000LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 28 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					SICK AG
Part No.	THTS-1AA541506MZ 6047613
Description	TEMPERATURE SENSORS
File Size	799.18K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54121-809071800LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 7 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					SICK AG
Part No.	THTS-1AA541006MZ 6047612
Description	TEMPERATURE SENSORS
File Size	799.19K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77311-118-09LF
Description	BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded Vertical Header, Through Hole, Single Row, 9 Positions
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	K7N801809B K7N803609B
Description	256Kx36 & 512Kx18 Pipelined NtRAM
File Size	394.30K / 19 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77311-418-09LF
Description	BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 09 Positions, 2.54 mm Pitch.
Tech specs				Official Product Page

					SAMSUNG[Samsung semiconductor]
Part No.	K7A803609A K7A801809A
Description	256Kx36 & 512Kx18 Synchronous SRAM
File Size	363.62K / 20 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54121-809161550LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K7A801809A K7A803609A
Description	256Kx36 & 512Kx18 Synchronous SRAM
File Size	366.99K / 20 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54122-105180950LF
Description	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 18 position, 2.54mm (0.100in) pitch
Tech specs				Official Product Page

					Dialight Corporation
Part No.	551-0209F 551-0309F 551-0409F 551-0509F 551-0609F 551-0709F 551-0809F 551-3009F 551-1209F C-17296 551-3109F 551-2509F 551-1809F 551-1109F
Description	3mm LED CBI RoHS COMPLIANT
File Size	152.02K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54111-809201800LF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Samsung Electronic
Part No.	K7A803609A K7A801809A
Description	256Kx36Bit Synchronous Pipelined Burst SRAM Data Sheet 512Kx18-Bit Synchronous Pipelined Burst SRAM Data Sheet
File Size	534.84K / 20 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54121-809081450LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Wurth Elektronik GmbH & Co. KG, Germany. Wurth Elektronik GmbH &...
Part No.	749010013 744761068A
Description	All 16 terminals must lie on a plane within 004 of surface A after lead tinning specification for release specification for release
File Size	158.90K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77311-818-09LF
Description	BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 09 Positions, 2.54 mm Pitch.
Tech specs				Official Product Page

					Cypress Semiconductor
Part No.	CY62157EV1809
Description	8-Mbit (512K x 16) Static RAM
File Size	412.26K / 12 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54121-809201800LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

For 4761-1809 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |

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