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  2602 Datasheet PDF File

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    Duracell
CEL[California Eastern Labs]
Part No. NESG260234-T1 NESG260234 NESG260234-T1-AZ
Description NPN SILICON GERMANIUM RF TRANSISTOR

File Size 240.09K  /  11 Page

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Amphenol Communications Solutions

Part No. 61083-162602LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90571-2602 0905712602

http://
Molex Electronics Ltd.
Part No. 90571-2602 0905712602
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, 60 Circuits, 0.76 μm Gold (Au)
2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, 60 Circuits, 0.76 μm Gold (Au)

File Size 350.67K  /  5 Page

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Amphenol Communications Solutions

Part No. 61083-182602LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 180 Positions.
Tech specs    

Official Product Page

    NEC, Corp.
Part No. NESG260234
Description 3-PIN POWER MINIMOLD 3 - Pin电源MINIMOLD

File Size 201.78K  /  4 Page

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Amphenol Communications Solutions

Part No. 61082-122602LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 120 Positions.
Tech specs    

Official Product Page

    0746952602 74695-2602

Molex Electronics Ltd.
Part No. 0746952602 74695-2602
Description 2.00mm (.079) Pitch 5-Row VHDM-HSD Backplane Header, Guide Pin SignalModule, Open End Version, Advanced Mate Shield, 100 Circuits, Pin Length 6.25mm
MOLEX Connector

File Size 397.29K  /  5 Page

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Amphenol Communications Solutions

Part No. 61082-042602LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 40 Positions.
Tech specs    

Official Product Page

    0878326022 87832-6022

Molex Electronics Ltd.
Part No. 0878326022 87832-6022
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 22 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Pick-and-Place Cap
2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 22 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Pick-and-Place Cap

File Size 367.83K  /  6 Page

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Amphenol Communications Solutions

Part No. 61082-102602LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 100 Positions.
Tech specs    

Official Product Page

    0878326023 87832-6023

Molex Electronics Ltd.
Part No. 0878326023 87832-6023
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 22 Circuits, 0.76μm (30μ) Gold (Au) Plating, with Pick-and-Place Cap
2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 22 Circuits, 0.76μm (30μ) Gold (Au) Plating, with Pick-and-Place Cap

File Size 386.48K  /  6 Page

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Amphenol Communications Solutions

Part No. 10145226-0211P13LF
Description DDR4 DIMM, Storage and Server Connector, Vertical , Through Hole, 288 Position , 0.85mm (0.033in) Pitch
Tech specs    

Official Product Page

    74650-2602 0746502602

Molex Electronics Ltd.
Part No. 74650-2602 0746502602
Description 2.00mm (.079) Pitch 8-Row VHDM-HSD Backplane Header, Guide Pin SignalModule, Signal Pin End Version, Advanced Mate Shield, 150 Circuits, Pin Length

File Size 386.34K  /  4 Page

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Amphenol Communications Solutions

Part No. 10145226-0212N13LF
Description DDR4 Memory Module Sockets, Storage and Server System, Vertical, Through Hole, 288 Position, 0.85mm (0.033in) pitch.
Tech specs    

Official Product Page

    NESG260234 NESG260234-T1

NEC[NEC]
Part No. NESG260234 NESG260234-T1
Description 3-PIN POWER MINIMOLD

File Size 184.80K  /  4 Page

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Amphenol Communications Solutions

Part No. 61082-122602PLF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 120 Positions.
Tech specs    

Official Product Page

    0746512602 74651-2602

Molex Electronics Ltd.
Part No. 0746512602 74651-2602
Description 2.00mm (.079) Pitch 8-Row VHDM-HSD?/a> Backplane Header, Guide Pin Signal Module, Shield Pin End Version, Advanced Mate Shield, 150 Circuits, Pin Length 6.25mm (.246)
2.00mm (.079) Pitch 8-Row VHDM-HSD Backplane Header, Guide Pin Signal Module, Shield Pin End Version, Advanced Mate Shield, 150 Circuits, Pin Length 6.25mm (.246)

File Size 360.92K  /  4 Page

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Amphenol Communications Solutions

Part No. 61083-082602LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 80 Positions.
Tech specs    

Official Product Page

    AUIRFP2602

International Rectifier
Part No. AUIRFP2602
Description HEXFET? Power MOSFET

File Size 216.43K  /  10 Page

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Amphenol Communications Solutions

Part No. 61083-142602LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 140 Positions.
Tech specs    

Official Product Page

For 2602 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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