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  192990-1580 Datasheet PDF File

For 192990-1580 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    0015800069-17

Molex Electronics Ltd.
Part No. 0015800069-17
Description 2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

File Size 24.91K  /  2 Page

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Amphenol Communications Solutions

Part No. 77315-801-31LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015800681 15-80-0681

Molex Electronics Ltd.
Part No. 0015800681 15-80-0681
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, Tin (Sn) Plating

File Size 1,218.24K  /  7 Page

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Amphenol Communications Solutions

Part No. 77315-801-07LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 7 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0015800067-17

Molex Electronics Ltd.
Part No. 0015800067-17
Description 2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

File Size 24.87K  /  2 Page

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Amphenol Communications Solutions

Part No. 77315-807-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    15-80-0385 0015800385

Molex Electronics Ltd.
Part No. 15-80-0385 0015800385
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. 75915-808HLF
Description Dubox® 2.54mm, Board to Board Connector,Vertical Receptacle, Through Hole, Single row , 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    15-80-0383 0015800383

Molex Electronics Ltd.
Part No. 15-80-0383 0015800383
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.08K  /  7 Page

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Amphenol Communications Solutions

Part No. 77315-801-27LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 27 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0015800065-17

Molex Electronics Ltd.
Part No. 0015800065-17
Description 2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

File Size 24.76K  /  2 Page

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Amphenol Communications Solutions

Part No. 10070158-00419XLF
Description D-Sub MicroTCA Connectors, Input Output Connectors, Single PCB Connector 24A 48V, Pin-in-Paste, Insert UNC 4.40, Carton Box.
Tech specs    

Official Product Page

    0015800409

Molex Electronics Ltd.
Part No. 0015800409
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Amphenol Communications Solutions

Part No. 75915-804
Description Dubox® 2.54mm, Board to Board Connector,Vertical Receptacle, Through Hole, Single row , 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015800263

Molex Electronics Ltd.
Part No. 0015800263
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.25K  /  7 Page

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Amphenol Communications Solutions

Part No. 77315-801-22LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 22 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    15-80-0509 0015800509

Molex Electronics Ltd.
Part No. 15-80-0509 0015800509
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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Amphenol Communications Solutions

Part No. 77315-801-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    15-80-0525 0015800525

Molex Electronics Ltd.
Part No. 15-80-0525 0015800525
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. 77315-801-12LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

For 192990-1580 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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