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Rochester Electronics LLC |
| Part No. |
LM6161J
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| Description |
LM6161 - Operational Amplifier, 1 Func, 7000uV Offset-Max, BIPolar, CDIP8
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| Tech specs |
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Official Product Page
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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TLP5701
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| Description |
Photocoupler (photo-IC output), IOP=+/-0.6 A, 5000 Vrms, SO6L
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Official Product Page
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Molex, Inc. MOLEX INC
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| Part No. |
39-29-0123 39-29-6208 39-31-0048 39-31-0107 39-31-0100 39-31-0080 39-28-1203 39-29-0063 39-31-0020 39-29-3226 39-30-6161 39-54-0042
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| Description |
Multipole Connector; Number of Contacts:12; Pitch Spacing:4.2mm; Number of Rows:2; Gender:Header; Series:5566; Body Material:PA Polyamide (Nylon) 6/6; Connecting Termination:Thru-Hole; Contact Plating:Gold 12 CONTACT(S), MALE, POWER CONNECTOR, SOLDER Header; Number of Contacts:20; Pitch Spacing:0.165"; Number of Rows:2; Series:Mini-Fit Jr.; Body Material:Nylon 6/6 20 CONTACT(S), MALE, POWER CONNECTOR, SOLDER Header; No. of Contacts:4; Pitch Spacing:0.165"; No. of Rows:2; Series:Mini-Fit Jr.; Body Material:Nylon 6/6 RoHS Compliant: Yes 4 CONTACT(S), MALE, POWER CONNECTOR, SOLDER Header; No. of Contacts:10; Pitch Spacing:0.165"; No. of Rows:2; Series:Mini-Fit Jr.; Body Material:Nylon 6/6 10 CONTACT(S), MALE, POWER CONNECTOR, SOLDER Header; No. of Contacts:8; Pitch Spacing:0.165"; No. of Rows:2; Series:Mini-Fit Jr.; Body Material:Nylon 6/6 8 CONTACT(S), MALE, POWER CONNECTOR, SOLDER Multipole Connector; Number of Contacts:20; Pitch Spacing:4.2mm; Number of Rows:2; Gender:Header; Series:5566; Body Material:PA Polyamide (Nylon) 6/6; Connecting Termination:Thru-Hole; Contact Plating:Tin 20 CONTACT(S), MALE, POWER CONNECTOR, SOLDER New Mini Fit Header Assy 6Ckt 6 CONTACT(S), MALE, POWER CONNECTOR, SOLDER Header; No. of Contacts:2; Pitch Spacing:0.165"; No. of Rows:2; Series:Mini-Fit Jr.; Body Material:Nylon 6/6 RoHS Compliant: Yes 2 CONTACT(S), MALE, POWER CONNECTOR, SOLDER A-5566-22B 22 CONTACT(S), MALE, POWER CONNECTOR, SOLDER 16 CONTACT(S), MALE, POWER CONNECTOR, SOLDER
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| File Size |
1,142.95K /
10 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
87061-617
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| Description |
Quickie®, Wire to Board Connector, Double Row, 68 Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-806161250LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127616-122A02LF
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| Description |
Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 38 Positions, 2.00mm (0.079in) Pitch..
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-806161000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10136161-101LF
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| Description |
ExaMAX® 56Gb/s High Speed Backplane Connector 85Ohm, 6-Pair, 6 column, 120 position, Right Angle Header, No Guide Pin.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10137926-1611LF
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| Description |
Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, Tin plating, Black Color, 16 Positions, GW Compatible LCP, Tape and Reel with cap.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-7616-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-6616-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
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Official Product Page
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