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  1070.0426 Datasheet PDF File

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    SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. S1A0426C01-S0B0 S1A0426C01 S1A0426C01-A0B0
Description AM/FM 1 CHIP RADIO

File Size 69.83K  /  4 Page

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Amphenol Communications Solutions

Part No. 77317-104-26LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 26 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    TF-AHP-1070HTT-A1-1011 TF-AHP-1070HTT-A2-1011

AAEON Technology
Part No. TF-AHP-1070HTT-A1-1011 TF-AHP-1070HTT-A2-1011
Description 7?WVGA HMI Touch Panel Computer With Onboard TI OMAP 600 MHz Processor

File Size 268.34K  /  2 Page

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Amphenol Communications Solutions

Part No. 61082-042602LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 40 Positions.
Tech specs    

Official Product Page

    BC10706 BC10.B BC107A

STMicroelectronics
Part No. BC10706 BC10.B BC107A
Description Low noise general purpose audio amplifiers

File Size 367.39K  /  9 Page

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Amphenol Communications Solutions

Part No. 77319-104-26LF
Description BergStik®, Board to Board connector, Unshrouded right angled header, Through Hole, Double Row, 26 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

    Engineered Components Company
Part No. 7SIPF-1070 7SIPF-20170 7SIPF-5170 7SIPF-570 7SIPF-2070
Description PASSIVE DELAY LINE, TRUE OUTPUT, SIP4 0.230 INCH HEIGHT, SIP-7/4

File Size 396.36K  /  4 Page

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Amphenol Communications Solutions

Part No. 78290-426HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    MTE1070A

Marktech Optoelectronics
MARKTECH[Marktech Corporate]
Part No. MTE1070A
Description INFRARED LED

File Size 70.93K  /  2 Page

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Amphenol Communications Solutions

Part No. 61083-042606LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 40 Positions.
Tech specs    

Official Product Page

    PTF01070

celduc-relais
Part No. PTF01070
Description Level sensor

File Size 472.70K  /  2 Page

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Amphenol Communications Solutions

Part No. 10042618-003LF
Description PCI Express® GEN 1 Card Edge, Storage and Server Connector, x16 Graphics Card Retention Mechanism.
Tech specs    

Official Product Page

    10700469

Schurter Inc.
Part No. 10700469
Description TOUCH SCREEN

File Size 227.57K  /  4 Page

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Amphenol Communications Solutions

Part No. 61082-042609LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 40 Positions.
Tech specs    

Official Product Page

    MTRS1070

Marktech Corporate
Part No. MTRS1070
Description Compact Package

File Size 58.32K  /  2 Page

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Amphenol Communications Solutions

Part No. 86840-426HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 26 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 5.84 mm (0.23in) Tail.
Tech specs    

Official Product Page

    10700447 1070.0447

Schurter Inc.
http://
Part No. 10700447 1070.0447
Description TOUCHSCREEN

File Size 170.38K  /  5 Page

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Amphenol Communications Solutions

Part No. 77317-804-26LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 26 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

    AB1070B-LW100-R

Projects Unlimited, Inc.
Part No. AB1070B-LW100-R
Description RELEASED FROM ENGINEERING

File Size 96.90K  /  1 Page

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Amphenol Communications Solutions

Part No. 68000-426HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

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