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  TSWIN-80850.320 Datasheet PDF File

For TSWIN-80850.320 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    Qualtek Electronics Cor...
Part No. QGKF-320 QGKF-320-12 QGKF-320-24 QGKF-320-48 QGKF-320-5
Description 320Watts Single Output

File Size 1,222.33K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-111080850RLF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    A22-01 A22-02 A22-20 A22-3200

Omron Electronics LLC
Part No. A22-01 A22-02 A22-20 A22-3200
Description Install in 22-dia. or 25-dia. Panel Cutout

File Size 762.90K  /  21 Page

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Amphenol Communications Solutions

Part No. 54122-107180850LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 18 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    KAF-3200-12-5-A-EVK

ON Semiconductor
Part No. KAF-3200-12-5-A-EVK
Description    Full Frame CCD Image Sensor

File Size 366.68K  /  15 Page

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Amphenol Communications Solutions

Part No. 54122-111080850LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    QP-320 QP-320D QP-320F

RSG Electronic Components GmbH
Part No. QP-320 QP-320D QP-320F
Description 320W Quad Output with PFC Function

File Size 129.12K  /  2 Page

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Amphenol Communications Solutions

Part No. 54111-803080850LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    BGA-320P-M06

Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
Part No. BGA-320P-M06
Description PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC

File Size 30.58K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-808501200LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 50 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    Kycon, Inc.
Part No. STX-3200-3NB
Description
File Size 219.69K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-110080850LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    MWC-160 MWC-320 MWC-250 MWC-40 MWC-450 MWC-80

List of Unclassifed Manufacturers
List of Unclassifed Man...
Part No. MWC-160 MWC-320 MWC-250 MWC-40 MWC-450 MWC-80
Description Wet-Type Multiple-Disk EM Clutch

File Size 212.51K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-104280850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 28 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Fujitsu Limited
Part No. BGA-320P-M06
Description PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC

File Size 29.48K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-105080850LF
Description BergStik, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking header, Through Hole, Double Row, 8 Positions.
Tech specs    

Official Product Page

    Xicon Passive Components
Part No. 320-1520-50K
Description
File Size 9.30K  /  1 Page

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    Kycon, Inc.
Part No. STX-3200-3CB
Description
File Size 233.63K  /  1 Page

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For TSWIN-80850.320 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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