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SG7915AL CX25895 CDLL828 06F224M1 H8S2506 NTE1376 HA174 3362S202
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  tin au Datasheet PDF File

For tin au Found Datasheets File :: 8657    Search Time::1.921ms    
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    MIMIX[Mimix Broadband]
Part No. XL1004
OCR Text ...preferred, then a fluxless gold-tin (auSn) preform, approximately 0.001 2 thick, placed between the die and the attachment surface should be...au 20% Sn) has a melting point of approximately 280 C (Note: Gold Germanium should be avoided). The ...
Description 35.0-45.0 GHz GaAs MMIC Low Noise Amplifier

File Size 155.12K  /  6 Page

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    MIMIX[Mimix Broadband]
Part No. XP1014
OCR Text ...preferred, then a fluxless gold-tin (auSn) preform, approximately 0.001 2 thick, placed between the die and the attachment surface should be...au 20% Sn) has a melting point of approximately 280 C (Note: Gold Germanium should be avoided). The ...
Description 8.5-11.0 GHz GaAs MMIC Power Amplifier

File Size 161.91K  /  5 Page

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    MIMIX[Mimix Broadband]
Part No. XP1015
OCR Text ...preferred, then a fluxless gold-tin (auSn) preform, approximately 0.001 2 thick, placed between the die and the attachment surface should be...au 20% Sn) has a melting point of approximately 280 C (Note: Gold Germanium should be avoided). The ...
Description 43.5-46.5 GHz GaAs MMIC Power Amplifier

File Size 267.04K  /  5 Page

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    MIMIX[Mimix Broadband]
Part No. XR1000
OCR Text ...preferred, then a fluxless gold-tin (auSn) preform, approximately 0.001 2 thick, placed between the die and the attachment surface should be...au 20% Sn) has a melting point of approximately 280 C (Note: Gold Germanium should be avoided). The ...
Description 17.0-27.0 GHz GaAs MMIC Receiver

File Size 487.68K  /  6 Page

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    MIMIX[Mimix Broadband]
Part No. XS1000
OCR Text ...preferred, then a fluxless gold-tin (auSn) preform, approximately 0.001 2 thick, placed between the die and the attachment surface should be...au 20% Sn) has a melting point of approximately 280 C (Note: Gold Germanium should be avoided). The ...
Description 7.0-13.0 GHz GaAs MMIC 6-Bit Phase Shifter

File Size 498.75K  /  6 Page

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    MIMIX[Mimix Broadband]
Part No. XX1002
OCR Text ...preferred, then a fluxless gold-tin (auSn) preform, approximately 0.001 2 thick, placed between the die and the attachment surface should be...au 20% Sn) has a melting point of approximately 280 C (Note: Gold Germanium should be avoided). The ...
Description 2.5-6.0/5.0-12.0 GHz GaAs MMIC Active Doubler

File Size 370.74K  /  5 Page

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    2MBI225U4J-120-50

Fuji Electric
Part No. 2MBI225U4J-120-50
OCR Text ...zation for spring landing pads. tin(Sn) can also be used. 9. Applicable category This specification is applied to IGBT-Module named 2MBI225U4J-120-50. MS5F6856 5 15 a H04-004-03a 10. Storage and transportation notes * Th...
Description IGBT Module

File Size 640.61K  /  15 Page

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    2MBI300U4J-120-50

Fuji Electric
Part No. 2MBI300U4J-120-50
OCR Text ...zation for spring landing pads. tin(Sn) can also be used. 9. Applicable category This specification is applied to IGBT-Module named 2MBI300U4J-120-50. MS5F6857 5 15 H04-004-03a 10. Storage and transportation notes * The modul...
Description IGBT Module

File Size 639.38K  /  15 Page

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    HMC-XDH158

Hittite Microwave Corporation
Part No. HMC-XDH158
OCR Text ...tectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 C and a tool temperature of 265 C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 C. DO NOT expose the ch...
Description GaAs MMIC X4 ACTIVE FREQUENCY MULTIPLIER, 54 - 64 GHz OUTPUT

File Size 190.21K  /  6 Page

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    HMC-MDB207

Hittite Microwave Corporation
Part No. HMC-MDB207
OCR Text ...tectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 C and a tool temperature of 265 C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 C. DO NOT expose the ch...
Description GaAs MMIC I/Q MIXER 55 - 64 GHz

File Size 237.64K  /  8 Page

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For tin au Found Datasheets File :: 8657    Search Time::1.921ms    
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