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perimeter Datasheet PDF File

For perimeter Found Datasheets File :: 914 Search Time::2.437ms
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				Z-Communications, Inc
Part No.	PCA1292A
OCR Text	...ius of all 14 half holes at the perimeter of the board are plated to provide a surface for the attachment of the PLL Module to the motherboard. 5 pads are for grounding, 8 pads are for signal interface. 2. The surface of the shield is tin-p...
Description	LOW COST - HIGH PERFORMANCE PHASE LOCKED LOOP
File Size	52.85K / 2 Page	View it Online	Download Datasheet

				ETC[ETC]
Part No.	ATT3000 ATT3020-100H68I ATT3020-100J68I ATT3020-100M132I ATT3020-100M44I ATT3020-100M68I ATT3020-100S68I ATT3020-100T132I ATT3020-100T44I ATT3020-100T84I ATT3020-125H68I ATT3020-125J44I ATT3030-100H68I ATT3030-100J44I ATT3030-100T44I ATT3030-100T84I ATT3042-100H84I ATT3042-100J44I ATT3042-125H132I ATT3042-125H44I ATT3042-125J84I ATT3042-70M68I ATT3042-70S132I ATT3020-70J44I ATT3020-70J84I ATT3020-70M132I ATT3030-70H84I ATT3030-70J84I ATT3030-70M132I ATT3030-70S132I ATT3030-70S68I ATT3064-100H44I ATT3064-100S84I ATT3064-70J132I ATT3064-70T132I ATT3064-70T84I ATT3064-125S132I ATT3090-100H132I ATT3090-100J44I ATT3090-100J68I ATT3090-100T68I ATT3090-70S44I ATT3090-70S84I ATT3030-70T132I ATT3042-100M132I ATT3042-100S132I ATT3042-100S44I ATT3042-100T132I ATT3090 ATT3042-100H132I ATT3042-100H44I ATT3042-100H68I ATT3042-100J132I ATT3042-100J68I ATT3042-100J84I ATT3042-100M44I ATT3042-100M68I ATT3042-100M84I ATT3042-100S68I ATT3042-100S84I ATT3042-100T44I ATT3042-100T68I ATT3042-100T84I ATT3042-125H68I ATT3042-125H84I ATT3042-125J132I ATT3042-125J44I ATT3042-125J68I ATT3042-125M132I ATT3042-125M44I ATT3030-70J132I ATT3064-100M84I ATT3030-70M84I ATT3090-125M84I ATT3020-70M68I ATT3020-70M84I
OCR Text	...pes of configurable elements: a perimeter of I/O blocks, a core array of logic blocks, and resources for interconnection. The general structure of an FPGA is shown in Figure 1. The ORCA Foundry for ATT3000 Development System provides automa...
Description	FIELD-PROGRAMMABLE GATE ARRAYS
File Size	496.45K / 80 Page	View it Online	Download Datasheet

				ITT Corporation
Part No.	DLM
OCR Text	...form mating pressure around the perimeter of the mated connector to create an EMI/RFI shield. Facilitates compliance of equipment to CE EMC directives. Applications: * Commercial/Industrial Manufacturing * Entertainment * Medical * Telec...
Description	ZERO INSERTION FORCE
File Size	83.78K / 1 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC486
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wit...
Description	GAAS PHEMT MMIC 2 WATT POWER AMPLIFIER, 7.0 - 9.0 GHZ
File Size	335.04K / 8 Page	View it Online	Download Datasheet

				ZCOMM[Z-Communications, Inc]
Part No.	CLV1225A-LF
OCR Text	...IUS OF ALL 14 HALF HOLES AT THE perimeter OF THE BOARD ARE PLATED TO PROVIDE A SURFACE FOR THE ATTACHMENT OF THE VCO TO A PCB IN 11 LOCATIONS, WITH 3 PADS BEING USED FOR ELECTROMECHANICAL INTERFACE. 14 SOLDER LOCATIONS REQUIRED. 2. THE SURF...
Description	VOLTAGE CONTROLLED OSCILLATOR
File Size	87.16K / 2 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC576
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wit...
Description	GAAS MMIC X2 ACTIVE FREQUENCY MULTIPLIER, 18 - 29 GHZ OUTPUT
File Size	253.25K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC578
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wit...
Description	GAAS MMIC X2 ACTIVE FREQUENCY MULTIPLIER, 24 - 33 GHZ OUTPUT
File Size	242.95K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC570
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic...
Description	GaAs MMIC I/Q DOWNCONVERTER 17 - 21 GHz
File Size	305.56K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC451
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wit...
Description	GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 5.0 - 20.0 GHz
File Size	343.24K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC516
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding RF bonds made with 0.003" x 0.0005" ribbon are recommended. These bonds should be thermosoni...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 7 - 17 GHz
File Size	289.37K / 6 Page	View it Online	Download Datasheet

For perimeter Found Datasheets File :: 914 Search Time::2.437ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |

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